Image shake correction device and imaging device

ABSTRACT

An image shake correction device includes: a movable member that is supported to be movable in plural directions along a flat surface; a circuit board that is fixed to the movable member; an imager that is mounted on the circuit board; and plural position detectors fixed to a rear surface of the circuit board opposite to a surface of the circuit board on which the imager is mounted to detect a position of the movable member in a movement direction of the movable member by a change of a magnetic field supplied from the rear surface side of the circuit board, plural circuit elements including magnetic materials is formed on the rear surface of the circuit board, and a high-density region is formed in a second region as defined herein.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation of International Application No.PCT/JP2018/036061 filed on Sep. 27, 2018, and claims priority fromJapanese Patent Application No. 2017-186874 filed on Sep. 27, 2017, theentire disclosures of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an image shake correction device and animaging device.

2. Description of the Related Art

An imaging device comprising an imager that images a subject through animaging optical system or a lens device used by being attached to theimaging device has an image shake correction function of correctingshake (hereinafter, referred to as image shake) of a captured imagecaused by vibration of the apparatus.

For example, in the lens device, image shake correction is performed bymoving a correction lens included in an imaging optical system in asurface perpendicular to an optical axis such that the vibration of theapparatus is detected based on information from a motion detectionsensor such as an acceleration sensor or angular velocity sensor mountedon the lens device and the detected vibration is canceled.

In the imaging device, the image shake correction is performed by movingone or both of the correction lens included in the imaging opticalsystem and the imager on a surface perpendicular to an optical axis suchthat the vibration of the apparatus is detected based on informationfrom a motion detection sensor such as an acceleration sensor or anangular velocity sensor mounted on the imaging device and the detectedvibration is canceled.

JP2015-055794A describes an image shake correction device that performsimage shake correction by moving a circuit board on which an imager ismounted.

SUMMARY OF THE INVENTION

In the image shake correction device that corrects image shake by movinga movable unit including the circuit board on which the imager ismounted, it is assumed that the image shake correction device is, forexample, in a normal posture (a posture in which a short direction of alight receiving surface of the imager is parallel to a gravitydirection). In this case, the movable unit is moved in the gravitydirection due to gravity in a state in which the movable unit is notdriven. Thus, a position of the imager is held at a reference positionby moving the movable unit in a direction opposite to the gravitydirection such that the movable unit is not moved due to gravity.

In a case where a weight of the movable unit is large, a power requiredto hold the movable unit at the reference position is also increased,and a usable time of the imaging device having the image shakecorrection device mounted thereon is shortened. JP2015-055794A does notconsider reduction of the power necessary for holding the movable unitat the reference position.

The present invention has been made in view of the above circumstances,and an object of the present invention is to provide an image shakecorrection device capable of reducing power consumption in a case whereimage shake is corrected by moving an imager, and an imaging deviceincluding the image shake correction device.

An image shake correction device of the present invention comprises amovable member that is supported to be movable in a plurality ofdirections along a flat surface, a circuit board that is fixed to themovable member, an imager that is mounted on the circuit board, and aplurality of position detectors that is fixed to a rear surface oppositeto a surface of the circuit board on which the imager is mounted todetect a position of the movable member in a movement direction of themovable member by a change of a magnetic field supplied from the rearsurface side of the circuit board. A plurality of circuit elementsincluding magnetic materials is formed on the rear surface of thecircuit board, and a high-density region in which the circuit elementsare disposed is formed in a second region around a first region on therear surface of the circuit board which overlaps a magnet that suppliesthe magnetic field with a density higher than a density of the circuitelements in a region excluding the second region on the rear surface ofthe circuit board, as viewed in a direction perpendicular to the flatsurface.

The imaging device of the present invention comprises the image shakecorrection device.

According to the present invention, it is possible to provide an imageshake correction device capable of reducing power consumption in a casewhere image shake is corrected by moving an imager, and an imagingdevice including the image shake correction device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a schematic configuration of a digitalcamera 100 which is an embodiment of an imaging device of the presentinvention.

FIG. 2 is a diagram showing a schematic configuration of an image shakecorrection device 3 in the digital camera 100 shown in FIG. 1.

FIG. 3 is a perspective view showing an appearance configuration of theimage shake correction device 3 shown in FIGS. 1 and 2.

FIG. 4 is an exploded perspective view of a support member 1 in a casewhere the support member 1 in the image shake correction device 3 shownin FIG. 3 is viewed from an imaging optical system 101 side.

FIG. 5 is an exploded perspective view of the support member 1 shown inFIG. 4 as viewed from a side opposite to the imaging optical system 101side.

FIG. 6 is a perspective view of a movable member 2 in the image shakecorrection device 3 shown in FIG. 3 as viewed from the imaging opticalsystem 101 side.

FIG. 7 is a perspective view of the movable member 2 shown in FIG. 6 asviewed from the side opposite to the imaging optical system 101 side.

FIG. 8 is a plan view of the movable member 2 shown in FIG. 6 as viewedfrom the side opposite to the imaging optical system 101 side.

FIG. 9 is a diagram showing a state in which a rear surface of a circuitboard 21 fixed to the movable member 2 shown in FIG. 7 is viewed in adirection Z.

FIG. 10 is a side view showing a state in which the circuit board 21fixed to the movable member 2 shown in FIG. 6 and a flexible printsubstrate connected to the circuit board are viewed in a direction X.

FIG. 11 is a front view of a first support member 1A shown in FIG. 4 asviewed from the imaging optical system 101 side.

FIG. 12 is a schematic diagram showing a state in which the firstsupport member 1A shown in FIG. 5 is viewed in the direction Z from theside opposite to the imaging optical system 101 side.

FIG. 13 is an enlarged view of a through-hole 11 a shown in FIG. 12.

FIG. 14 is a diagram showing a modification example of movementrestriction units MR1 and MR2 shown in FIG. 12.

FIG. 15 is a diagram showing a modification example of the first supportmember 1A shown in FIG. 11.

FIG. 16 is a diagram showing a modification example of a base 22 of themovable member 2 shown in FIG. 8.

FIG. 17 is a diagram showing a modification example of the arrangementof hooks 160 a to 160 c shown in FIG. 15 in the base 10.

FIG. 18 is a diagram showing another modification example of the firstsupport member 1A shown in FIG. 11.

FIG. 19 is a schematic diagram showing a preferable configurationexample of the rear surface of the circuit board 21 in the image shakecorrection device 3.

FIG. 20 is a diagram showing a first modification example of the circuitboard 21 shown in FIG. 19.

FIG. 21 is a diagram showing a second modification example of thecircuit board 21 shown in FIG. 19.

FIG. 22 shows an appearance of a smartphone 200 that is an embodiment ofan imaging device of the present invention.

FIG. 23 is a block diagram showing a configuration of the smartphone 200shown in FIG. 22.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the drawings.

FIG. 1 is a diagram showing a schematic configuration of a digitalcamera 100 which is an embodiment of an imaging device of the presentinvention.

The digital camera 100 comprises an imaging optical system 101, animager 20, an image shake correction device 3, an imager drive unit 105that drives the imager 20, an analog front end (AFE) 104, an imageprocessing unit 107, a motion detection sensor 106, and a systemcontroller 108 that performs overall control of the entire digitalcamera 100.

The imaging optical system 101 includes a focus lens or a zoom lens, anda stop.

The imager 20 images a subject through the imaging optical system 101,and comprises a semiconductor chip on which a charge coupled device(CCD) image sensor or a complementary metal oxide semiconductor (CMOS)image sensor is formed and a package that accommodates the semiconductorchip.

As shown in FIG. 3 to be described below, a light receiving surface 20 aof the imager 20 has a rectangular shape.

The image shake correction device 3 corrects image shake of a capturedimage captured by the imager 20 by moving the light receiving surface 20a of the imager 20 within a surface perpendicular to an optical axis Kof the imaging optical system 101.

In the present specification, in the digital camera 100, the lightreceiving surface 20 a of the imager 20 is perpendicular to a gravitydirection (the optical axis K is parallel to the gravity direction), anda state in which the image shake correction device 3 is not energized isa reference state. In this reference state, a center P (see FIG. 3) ofthe light receiving surface 20 a is located on the optical axis K.

Although the detailed configuration of the image shake correction device3 will be described below, the image shake is corrected by moving theimager 20 in three directions of a first direction which is alongitudinal direction (direction X shown in FIG. 3) of the lightreceiving surface 20 a of the imager 20 in the reference state, a seconddirection which is a short direction (direction Y shown in FIG. 3) ofthe light receiving surface 20 a of the imager 20 in the referencestate, and a third direction which is a direction (direction θ shown inFIG. 3) along a circumference of a circle using the center P of thelight receiving surface 20 a of the imager 20 in this reference state asa center.

The AFE 104 includes a signal processing circuit that performscorrelative double sampling processing and digital conversion processingon imaging signals output from the imager 20.

The image processing unit 107 performs digital signal processing on theimaging signals processed by the AFE 104, and generates captured imagedata such as a Joint Photographic Experts Group (JPEG) format.

The motion detection sensor 106 is a sensor that detects the movement ofthe digital camera 100, and includes an acceleration sensor, an angularvelocity sensor, or both thereof.

The system controller 108 controls the imager drive unit 105 and the AFE104 such that the subject is captured by the imager 20 and the imagingsignal corresponding to a subject image is output from the imager 20.

The system controller 108 controls the image shake correction device 3based on movement information of the digital camera 100 detected by themotion detection sensor 106. The system controller 108 corrects theimage shake of the captured image captured by the imager 20 by movingthe light receiving surface 20 a of the imager 20 in at least one of thedirection X, the direction Y, and the direction θ.

In a state in which the image shake correction device 3 is energized, ina case where the movement of the digital camera 100 is not detected bythe motion detection sensor 106, the system controller 108 controls theimage shake correction device 3 such that a position of the lightreceiving surface 20 a of the imager 20 is a position in the referencestate.

FIG. 2 is a diagram showing a schematic configuration of the image shakecorrection device 3 in the digital camera 100 shown in FIG. 1.

The image shake correction device 3 comprises a movable member 2 movablein each of the directions X, Y, and θ, and a support member thatsupports the movable member 2 to be movable in each of the directions X,Y, and θ.

A circuit board 21 on which the imager 20 is fixed (mounted), an X-axisrotation drive coil C1, an X-axis rotation drive coil C2, and a Y-axisdrive coil C3 are fixed to the movable member 2.

An X-axis position detection Hall element H1 that is a position detectorfor detecting a position of the movable member 2 in the direction X, anda Y-axis rotation position detection Hall element H2 and a Y-axisrotation position detection Hall element H3 which are position detectorsfor detecting positions of the movable member 2 in the direction Y andthe direction θ are fixed to the circuit board 21.

Output signals of the X-axis position detection Hall element H1, theY-axis rotation position detection Hall element H2, and the Y-axisrotation position detection Hall element H3 are input to the systemcontroller 108.

The system controller 108 moves the movable member 2 by controlling acontrol current flowing through the X-axis rotation drive coil C1, acontrol current flowing through the X-axis rotation drive coil C2, and acontrol current flowing through the Y-axis drive coil C3 based on theoutput signals, and corrects the image shake.

The support member 1 includes a first support member 1A and a secondsupport member 1B.

An X-axis rotation drive magnet Mv1, an X-axis rotation drive magnetMv2, a Y-axis drive magnet Mv3, an X-axis position detection magnet Mh1,a Y-axis rotation position detection magnet Mh2, and a Y-axis rotationposition detection magnet Mh3 are fixed to the first support member 1A.

The X-axis rotation drive magnet mv1, the X-axis rotation drive magnetmv2, and the Y-axis drive magnet mv3 are fixed to the second supportmember 1B.

FIG. 3 is a perspective view showing an appearance configuration of theimage shake correction device 3 shown in FIGS. 1 and 2. FIG. 3 shows anappearance of the image shake correction device 3 in the referencestate.

As shown in FIG. 3, the image shake correction device 3 comprises thesupport member 1 constituted by the first support member 1A and thesecond support member 1B and the movable member 2 to which the circuitboard 21 on which the imager 20 is mounted is fixed. The movable member2 is biased against the first support member 1A by springs 24 a, 24 b,and 24 c which are elastic members.

The springs 24 a, 24 b, and 24 c may be any springs that can urge themovable member 2 to the first support member 1A by an elastic force, andmay be replaced with rubber which is an elastic member, for example.

This image shake correction device 3 is fixed to a main body of thedigital camera 100 in a state in which the light receiving surface 20 afaces the imaging optical system 101 shown in FIG. 1.

The image shake correction device 3 corrects the image shake by movingthe movable member 2 in the direction θ using, as a center, a rotationaxis R (an axis which is parallel to the gravity direction and passesthrough the center P in the reference state) which is perpendicular tothe light receiving surface 20 a and passes through the center P of thelight receiving surface 20 a, the direction X which is the longitudinaldirection of the light receiving surface 20 a, and the direction Y whichis the short direction of the light receiving surface 20 a.

Hereinafter, a direction in which the rotation axis R extends isreferred to as a direction Z. A flat surface perpendicular to therotation axis R is a flat surface on which the movable member 2 moves.

The movable member 2 is movable in one direction (left direction) of thedirection X and the other direction (right direction) of the direction Xfrom the reference state by the same distance.

The movable member 2 is movable in one direction (up direction) of thedirection Y and the other direction (down direction) of the direction Yfrom the reference state by the same distance.

The movable member 2 is rotatable in one direction (right rotationdirection) of the direction θ and the other direction (left rotationdirection) of the direction θ from the reference state by the sameangle.

In the digital camera 100 shown in FIG. 1, a posture in which thedirection Y shown in FIG. 3 is parallel to the gravity direction is anormal posture (a posture for performing so-called horizontal imaging).

FIG. 4 is an exploded perspective view of the support member 1 in theimage shake correction device 3 shown in FIG. 3 as viewed from theimaging optical system 101 side.

FIG. 5 is an exploded perspective view of the support member 1 shown inFIG. 4 as viewed from a side opposite to the imaging optical system 101side.

As shown in FIGS. 4 and 5, the first support member 1A comprises aplate-like base 10 that is made of resin and has a flat surfaceperpendicular to the direction Z, and projecting portions 17 a, 17 b,and 17 c extending in the direction Z from a peripheral portion of thebase 10 to the imaging optical system 101 side.

The second support member 1B has a substantially L-shaped yoke 18 asviewed from the imaging optical system 101 side. A hole portion 19 a andnotch portions 19 b and 19 c at positions facing the projecting portions17 a, 17 b and 17 c are formed at the yoke 18.

In a state in which the movable member 2 is disposed between the firstsupport member 1A and the second support member 1B, the projectingportion 17 a of the first support member 1A is fixed by being fittedinto the hole portion 19 a of the second support member 1B, theprojecting portion 17 b of the first support member 1A is fixed by beingfitted into the notch portion 19 b of the second support member 1B, andthe projecting portion 17 c of the first support member 1A is fixed bybeing fitted into the notch portion 19 c of the second support member1B. Accordingly, the movable member 2 is supported by the support member1.

As shown in FIG. 4, substantially L-shaped yokes 14 as viewed from theimaging optical system 101 side are formed at a left end portion in thedirection X and a lower end portion in the direction Y as viewed fromthe imaging optical system 101 side on a surface of the base 10 on theimaging optical system 101 side.

The X-axis rotation drive magnet Mv1 constituting a first drive magnetand the X-axis rotation drive magnet Mv2 constituting a second drivemagnet are arranged and fixed on a front surface of portions of theyokes 14 of the first support member 1A that extends along the directionY with a space in the direction Y.

As viewed from the imaging optical system 101 side, the X-axis rotationdrive magnet Mv1 is disposed such that an N-pole faces the rightdirection of the direction X and an S-pole faces the left direction ofthe direction X.

As viewed from the imaging optical system 101 side, the X-axis rotationdrive magnet Mv2 is disposed such that an N-pole faces the leftdirection of the direction X and an S-pole faces the right direction ofthe direction X.

The Y-axis drive magnet Mv3 constituting a third drive magnet is fixedon a front surface of a portion of the yoke 14 of the first supportmember 1A that extends along the direction X.

As viewed from the imaging optical system 101 side, the Y-axis drivemagnet Mv3 is disposed such that an N-pole faces the down direction ofthe direction Y and an S-pole faces the up direction of the direction Y.

As shown in FIG. 5, the X-axis rotation drive magnet mv1 is fixed on afront surface of the yoke 18 of the second support member 1B on thefirst support member 1A side at a position facing the X-axis rotationdrive magnet Mv1 of the first support member 1A with the X-axis rotationdrive coil C1 of the movable member 2 described in FIG. 7 interposedtherebetween.

An S-pole of the X-axis rotation drive magnet mv1 faces the N-pole ofthe X-axis rotation drive magnet Mv1 with the X-axis rotation drive coilC1 interposed therebetween. An N-pole of the X-axis rotation drivemagnet mv1 faces the S-pole of the X-axis rotation drive magnet Mv1 withthe X-axis rotation drive coil C1 interposed therebetween.

As shown in FIG. 5, the X-axis rotation drive magnet mv2 is fixed on afront surface of the yoke 18 of the second support member 1B on thefirst support member 1A side at a position facing the X-axis rotationdrive magnet Mv2 of the first support member 1A with the X-axis rotationdrive coil C2 of the movable member 2 described in FIGS. 6 to 8interposed therebetween.

An S-pole of the X-axis rotation drive magnet mv2 faces the N-pole ofthe X-axis rotation drive magnet Mv2 with the X-axis rotation drive coilC2 interposed therebetween. An N-pole of the X-axis rotation drivemagnet mv2 faces the S-pole of the X-axis rotation drive magnet Mv2 withthe X-axis rotation drive coil C2 interposed therebetween.

As shown in FIG. 5, the Y-axis drive magnet mv3 is fixed on a frontsurface of the yoke 18 of the second support member 1B on the firstsupport member 1A side at a position facing the Y-axis drive magnet Mv3with the Y-axis drive coil C3 of the movable member 2 described in FIGS.6 to 8 interposed therebetween.

An S-pole of the Y-axis drive magnet mv3 faces the N-pole of the Y-axisdrive magnet Mv3 with the Y-axis drive coil C3 interposed therebetween.An N-pole of the Y-axis drive magnet mv3 faces the S-pole of the Y-axisdrive magnet Mv3 with the Y-axis drive coil C3 interposed therebetween.

As shown in FIG. 4, substantially plus-shaped yokes 12 as viewed in thedirection Z are formed at a portion facing the circuit board 21 fixed tothe movable member 2 described in FIGS. 6 to 8 on a surface of theimaging optical system 101 side of the base 10 of the first supportmember 1A.

The X-axis position detection magnet Mh1 constituting a first positiondetection magnet is fixed on a front surface of the yoke 12 at aposition facing the X-axis position detection Hall element H1 (see FIG.7 to be described below) fixed to the circuit board 21 fixed to themovable member 2.

The X-axis position detection magnet Mh1 has an S-pole 1 s and an N-pole1 n which are arranged with a space in the direction X, and the X-axisposition detection Hall element H1 is disposed so as to face anintermediate position between the S-pole 1 s and the N-pole 1 n.

The N-pole 1 n of the X-axis position detection magnet Mh1 is disposedon the left side in the direction X as viewed from the imaging opticalsystem 101 side with respect to the S-pole 1 s of the X-axis positiondetection magnet Mh1.

The Y-axis rotation position detection magnet Mh2 constituting a secondposition detection magnet is fixed on the front surface of the yoke 12at a position facing the Y-axis rotation position detection Hall elementH2 (see FIG. 7 to be described below) fixed to the circuit board 21fixed to the movable member 2.

The Y-axis rotation position detection magnet Mh2 has an S-pole 2 s andan N-pole 2 n arranged with a space in the direction Y, and the Y-axisrotation position detection Hall element H2 is disposed so as to face anintermediate position between the S-pole 2 s and the N-pole 2 n.

The N-pole 2 n of the Y-axis rotation position detection magnet Mh2 isdisposed on the upper side of the direction Y as viewed from the imagingoptical system 101 side with respect to the S-pole 2 s of the Y-axisrotation position detection magnet Mh2.

The Y-axis rotation position detection magnet Mh3 constituting a thirdposition detection magnet is fixed on the front surface of the yoke 12at a position facing the Y-axis rotation position detection Hall elementH3 (see FIG. 7 to be described below) fixed to the circuit board 21fixed to the movable member 2.

The Y-axis rotation position detection magnet Mh3 has an S-pole 3 s andan N-pole 3 n arranged with a space in the direction Y, and the Y-axisrotation position detection Hall element H3 is disposed so as to face anintermediate position between the S-pole 3 s and the N-pole 3 n.

The N-pole 3 n of the Y-axis rotation position detection magnet Mh3 isdisposed on the lower side of the direction Y as viewed from the imagingoptical system 101 side with respect to the S-pole 3 s of the Y-axisrotation position detection magnet Mh3.

In the example shown in FIG. 4, the X-axis position detection magnetMh1, the Y-axis rotation position detection magnet Mh2, and the Y-axisrotation position detection magnet Mh3 are coupled and integrated by acoupling member 13. Since the coupling member 13 is fixed to the yoke12, the X-axis position detection magnet Mh1, the Y-axis rotationposition detection magnet Mh2, and the Y-axis rotation positiondetection magnet Mh3 are fixed to the first support member 1A.

As shown in FIG. 5, the yoke 12 is fixed to the base 10 by screws SC1 toSC4 inserted from screw holes formed on a surface opposite to theimaging optical system 101 side of the base 10 of the first supportmember 1A.

The screw SC1 and the screw SC2 are respectively screwed into two screwholes formed so as to be arranged in the direction Y at a portionextending along the direction Y of the plus-shaped yoke 12.

The screw SC3 and the screw SC4 are respectively screwed into two screwholes formed so as to be arranged in the direction X at a portionextending along the direction X of the plus-shaped yoke 12.

As shown in FIG. 4, three flat surfaces 15 a, 15 b, and 15 cperpendicular to the direction Z are formed on the surface of theimaging optical system 101 side of the base 10. The positions of theflat surfaces 15 a, 15 b, and 15 c in the direction Z are all the same,and these flat surfaces are all formed on the same flat surface.

On the surface on the imaging optical system 101 side of the base 10, athrough-hole 11 a for restricting the movement of the movable member 2is formed on an upper side in the direction Y from the Y-axis rotationposition detection magnet Mh3, and a through-hole 11 b for restrictingthe movement of the movable member 2 is formed on a lower side in thedirection Y from the Y-axis rotation position detection magnet Mh2, asviewed from the imaging optical system 101 side.

A hook 16 a extending in the direction X in which one end of the spring24 a shown in FIG. 3 is locked, a hook 16 b extending in the updirection of the direction Yin which one end of the spring 24 b shown inFIG. 3 is locked, and a hook 16 c extending in the down direction of thedirection Y in which one end of the spring 24 c shown in FIG. 3 islocked are formed at a peripheral portion of the base 10.

FIG. 6 is a perspective view of the movable member 2 in the image shakecorrection device 3 shown in FIG. 3 as viewed from the imaging opticalsystem 101 side.

FIG. 7 is a perspective view of the movable member 2 shown in FIG. 6 asviewed from the side opposite to the imaging optical system 101 side.

FIG. 8 is a plan view of the movable member 2 shown in FIG. 6 as viewedfrom the side opposite to the imaging optical system 101 side. In FIG.8, in order to facilitate understanding of the configuration of themovable member 2, the circuit board 21 fixed to the movable member 2 isindicated by a broken line, and flexible print substrates 25, 26, and 27connected to the circuit board 21 are indicated by imaginary lines.

As shown in FIG. 8, the movable member 2 comprises a substantiallyC-shaped base 22 constituted a straight-line-shaped portion extending inthe direction X, a straight-line-shaped portion extending in thedirection Y from a right end portion of this portion in the direction X,and a straight-line-shaped portion extending to the left side in thedirection X from a lower end portion of a portion extending in thedirection Y as viewed from the imaging optical system 101 side.

As shown in FIGS. 6 and 7, the circuit board 21 on which the imager 20is mounted is fixed to the base 22 with an adhesive at a portion facinga region surrounded by the three portions.

As shown in FIGS. 6 to 8, the X-axis rotation drive coil C1 is formed atthe base 22 at a position facing each of the X-axis rotation drivemagnets Mv1 and mv1 shown in FIG. 4.

The X-axis rotation drive coil C2 is formed at the base 22 at a positionfacing each of the X-axis rotation drive magnets Mv2 and mv2 shown inFIG. 4.

The Y-axis drive coil C3 is formed at the base 22 at a position facingeach of the Y-axis drive magnets Mv3 and mv3 shown in FIG. 4.

The X-axis rotation drive coil C1 shown in FIGS. 6 to 8 and the X-axisrotation drive magnets Mv1 and mv1 shown in FIG. 4 constitute an X-axisdrive voice coil motor (VCM).

The X-axis drive VCM moves the movable member 2 in the direction X byelectromagnetic induction between the X-axis rotation drive coil C1 andthe X-axis rotation drive magnets Mv1 and mv1 by causing a controlcurrent to flow through the X-axis rotation drive coil C1.

The X-axis rotation drive coil C2 shown in FIGS. 6 to 8 and the X-axisrotation drive magnets Mv2 and mv2 shown in FIG. 4 constitute a VCM.This VCM and the X-axis drive VCM constitute a rotation drive VCM.

The rotation drive VCM rotates the movable member 2 around the rotationaxis R with the center P of the light receiving surface 20 a with arotation center by an electromagnetic induction action between theX-axis rotation drive coil C1 and the X-axis rotation drive magnets Mv1and mv1 and an electromagnetic induction between the X-axis rotationdrive coil C2 and the X-axis rotation drive magnets Mv2 and mv2 byreversing the directions of the control currents flowing through theX-axis rotation drive coil C1 and the X-axis rotation drive coil C2shown in FIGS. 6 to 8.

The Y-axis drive coil C3 shown in FIGS. 6 to 8 and the Y-axis drivemagnets Mv3 and mv3 shown in FIG. 4 constitute a Y-axis drive VCM.

The Y-axis drive VCM moves the movable member 2 in the direction Y by anelectromagnetic induction between the Y-axis drive coil C3 and theY-axis drive magnets Mv3 and mv3 by causing the control current to flowthrough the Y-axis drive coil C3.

As shown in FIG. 7, the X-axis position detection Hall element H1 isfixed at a position facing the intermediate position between the S-pole1 s and the N-pole 1 n of the X-axis position detection magnet Mh1 on asurface of the first support member 1A side of the circuit board 21fixed to the base 22 (hereinafter, referred to as a rear surface of thecircuit board 21).

The Y-axis rotation position detection Hall element H2 is fixed at aposition facing the intermediate position between the S-pole 2 s and theN-pole 2 n of the Y-axis rotation position detection magnet Mh2 on therear surface of the circuit board 21.

The Y-axis rotation position detection Hall element H3 is fixed at aposition facing the intermediate position between the S-pole 3 s and theN-pole 3 n of the Y-axis rotation position detection magnet Mh3 on therear surface of the circuit board 21.

The X-axis position detection Hall element H1 outputs a signalcorresponding to a magnetic field supplied from the X-axis positiondetection magnet Mh1, and the system controller 108 detects a positionof the movable member 2 in the direction X by an output change of thissignal.

The Y-axis rotation position detection Hall element H2 outputs a signalcorresponding to a magnetic field supplied from the Y-axis rotationposition detection magnet Mh2, and the system controller 108 detects aposition of the movable member 2 in the direction Y by an output changeof this signal.

The Y-axis rotation position detection Hall element H3 outputs a signalcorresponding to a magnetic field supplied from the Y-axis rotationposition detection magnet Mh3.

The system controller 108 detects, as a position of the movable member 2in the direction θ, a rotation angle of the movable member 2 around therotation axis R due to the change of the output signal of the Y-axisrotation position detection Hall element H3 and the change of the outputsignal of the Y-axis rotation position detection Hall element H2.

FIG. 9 is a diagram showing a state in which the rear surface of thecircuit board 21 fixed to the base 22 of the movable member 2 shown inFIG. 7 is viewed in the direction Z.

In FIG. 9, the center P of the light receiving surface 20 a of theimager 20 that overlaps the rear surface of the circuit board 21 isshown. In FIG. 9 a straight line L1 which passes through the center Pand is parallel to the direction X, and the Y-axis rotation positiondetection Hall element H2 and the Y-axis rotation position detectionHall element H3 are arranged on the straight line L1. A distance fromthe Y-axis rotation position detection Hall element H2 to the center Pand a distance from the Y-axis rotation position detection Hall elementH3 to the center P are the same.

As shown in FIG. 4, the Y-axis rotation position detection magnet Mh2facing the Y-axis rotation position detection Hall element H2 and theY-axis rotation position detection magnet Mh3 facing the Y-axis rotationposition detection Hall element H3 are arranged such that magnetic polesare opposite to each other in the direction Y.

In a case where the movable member 2 rotates in the right direction ofthe direction θ as viewed from the imaging optical system 101 side, theY-axis rotation position detection Hall element H2 and the Y-axisrotation position detection Hall element H3 move in opposite directionsto each other in the direction Y by the same distance. Thus, the outputsof the Y-axis rotation position detection Hall element H2 and the Y-axisrotation position detection Hall element H3 are changed in the samemanner.

The output signal of the Y-axis rotation position detection Hall elementH2 output signal, the movement direction and the movement distance ofthe Y-axis rotation position detection Hall element H2, the outputsignal of the Y-axis rotation position detection Hall element H3, themovement direction and the movement distance of the Y-axis rotationposition detection Hall element H3, and the rotation angle of themovable member 2 in the direction θ are associated with each other inadvance, and thus, it is possible to detect the rotation position of themovable member 2 in the direction θ by the output signals of the Y-axisrotation position detection Hall element H2 and the Y-axis rotationposition detection Hall element H3.

Meanwhile, in a case where the movable member 2 moves only in thedirection Y, the Y-axis rotation position detection Hall element H2 andthe Y-axis rotation position detection Hall element H3 move in the samedirection in the direction Y by the same distance.

Thus, the output signals of the Y-axis rotation position detection Hallelement H2 and the Y-axis rotation position detection Hall element H3are changed in opposite directions.

Therefore, in a case where the outputs of the Y-axis rotation positiondetection Hall element H2 and the Y-axis rotation position detectionHall element H3 are changed in opposite directions, it is possible todetect the position of the movable member 2 in the direction Y byviewing the output of the Y-axis rotation position detection Hallelement H2 or the Y-axis rotation position detection Hall element H3.

As shown in FIGS. 6 to 8, a hook 23 a extending in the same direction(direction X) as the hook 16 a is formed at the base 22 at a positionfacing the hook 16 a (see FIG. 4) of the support member 1. The other endof the spring 24 a shown in FIG. 3 is locked to the hook 23 a.

The movable member 2 is biased toward the first support member 1A by thespring 24 a locked to the hooks 16 a and 23 a.

As shown in FIGS. 6 and 8, a hook 23 b extending in the same direction(up direction of the direction Y) as the hook 16 b is formed at the base22 at a position facing the hook 16 b (see FIG. 4) of the support member1. The other end of the spring 24 b shown in FIG. 3 is locked to thehook 23 b.

The movable member 2 is biased toward the first support member 1A by thespring 24 b locked to the hooks 16 b and 23 b.

As shown in FIGS. 6 to 8, a hook 23 c extending in the same direction(down direction of the direction Y) as the hook 16 c is formed at thebase 22 at a position facing the hook 16 c (see FIG. 4) of the supportmember 1. The other end of the spring 24 c shown in FIG. 3 is locked tothe hook 23 c.

The movable member 2 is biased toward the first support member 1A by thespring 24 c locked to the hooks 16 c and 23 c.

The pair of the hook 16 a and the hook 23 a, the pair of the hook 16 band the hook 23 b, and the pair of the hook 16 c and the hook 23 c areformed such that a center of gravity of the movable member 2 is disposedinside a triangle formed by connecting these three pairs in plan viewviewed in the direction Z.

As shown in FIGS. 7 and 8, a recess portion 290 a that accommodates arolling element (spherical ball) for causing the movable member 2 to bemovable on a surface perpendicular to the direction Z at a positionfacing the flat surface 15 a of the first support member 1A shown inFIG. 4 is formed at the base 22. A bottom surface 29 a of the recessportion 290 a is a flat surface perpendicular to the direction Z.

A recess portion 290 b that accommodates a rolling element for causingthe movable member 2 to be movable on the surface perpendicular to thedirection Z at a position facing the flat surface 15 b of the firstsupport member 1A shown in FIG. 4 is formed at the base 22. A bottomsurface 29 b of the recess portion 290 b is a flat surface perpendicularto the direction Z.

A recess portion 290 c that accommodates a rolling element for causingthe movable member 2 to be movable on the surface perpendicular to thedirection Z is formed at the base 22 at a position facing the flatsurface 15 c of the first support member 1A shown in FIG. 4. A bottomsurface 29 c of the recess portion 290 c is a flat surface perpendicularto the direction Z.

The positions of the bottom surfaces 29 a, 29 b, and 29 c in thedirection Z are all the same, and the bottom surfaces are all formed onthe same flat surface.

The movable member 2 moves on the flat surface perpendicular to thedirection Z by rolling the rolling elements disposed between the bottomsurface 29 a of the movable member 2 and the flat surface 15 a of thefirst support member 1A, between the bottom surface 29 b of the movablemember 2 and the flat surface 15 b of the first support member 1A, andbetween the bottom surface 29 c of the movable member 2 and the flatsurface 15 c of the first support member 1A.

As shown in FIG. 8, an attachment portion 28A is formed on the surfaceof the first support member 1A side of the base 22. As shown in FIG. 7,a flat plate portion 280 a extending in the down direction of thedirection Y at a position overlapping the circuit board 21 is fixed tothe attachment portion 28A with screws. An insertion member 28 aprotruding in the direction Z toward the first support member 1A side isformed at the flat plate portion 280 a.

As shown in FIG. 8, an attachment portion 28B is formed on the surfaceof the first support member 1A side of the base 22. As shown in FIG. 7,a flat plate portion 280 b extending in the up direction of thedirection Y at a position overlapping the circuit board 21 is fixed tothe attachment portion 28B with screws. An insertion member 28 bprotruding in the direction Z toward the first support member 1A side isformed at the flat plate portion 280 b.

The insertion member 28 a is inserted into the through-hole 11 a of thefirst support member 1A shown in FIG. 4. The insertion member 28 b isinserted into the through-hole 11 b of the first support member 1A shownin FIG. 4.

In a case where the movable member 2 moves on the surface perpendicularto the direction Z, the movement range of the insertion member 28 a islimited to the inside of the through-hole 11 a, and the movement rangeof the insertion member 28 b is limited to the inside of thethrough-hole 11 b. Thus, the movement range of the movable member 2 (themovement range in the direction X, the movement range in the directionY, and the movement range in the direction θ) is restricted to apredetermined range by the pair of the insertion member 28 a and thethrough-hole 11 a and the pair of the insertion member 28 b and thethrough-hole 11 b.

The pair of the insertion member 28 a and the through-hole 11 aconstitutes a movement restriction unit MR1 (see FIG. 12 to be describedbelow) that restricts the movement range of the movable member 2. Thepair of the insertion member 28 b and the through-hole 11 b constitutesa movement restriction unit MR2 (see FIG. 12 to be described below) thatrestricts the movement range of the movable member 2.

As shown in FIG. 7, a connector 21 a and a connector 21 b are formed atan upper end portion of the rear surface of the circuit board 21 fixedto the movable member 2 in the direction Y. A connector 21 c is formedat an end portion on a side close to the base 22 among the end portionson the rear surface of the circuit board 21 in the direction X.

The connector 21 a and the connector 21 b include terminals connected tovarious terminals (a power supply terminal which is a terminal forsupplying a power, a ground terminal which is a terminal for grounding,a terminal for outputting a signal, and a drive terminal) of the imager20 mounted on the circuit board 21.

The flexible print substrate 26 which is a first flexible substrateincluding wirings connected to the terminals included in the connectorsis connected to the connector 21 a.

The flexible print substrate 25 which is a first flexible substrateincluding wirings connected to the terminals included in the connectorsis connected to the connector 21 b.

The connector 21 c includes terminals connected to output terminals ofthe X-axis position detection Hall element H1, the Y-axis rotationposition detection Hall element H2, and the Y-axis rotation positiondetection Hall element H3 mounted on the rear surface of the circuitboard 21.

The flexible print substrate 27 which is a second flexible substrateincluding wirings connected to the terminals included in the connectoris connected to the connector 21 c.

The flexible print substrate 27 includes a fixed portion 27 a thatextends along the direction Y and is fixed to the base 22, and anon-fixed portion 27 b that is free with respect to the base 22.

A movable unit is constituted by the movable member 2 that includes theX-axis rotation drive coil C1, the X-axis rotation drive coil C2, andthe Y-axis drive coil C3, the imager 20, the circuit board 21 thatincludes the X-axis position detection Hall element H1, the Y-axisrotation position detection Hall element H2, and the Y-axis rotationposition detection Hall element H3, and the flexible print substrates 25to 27 connected to the circuit board 21. The movable support device isconstituted by the movable unit and the support member 1.

FIG. 10 is a side view showing of the circuit board 21 fixed to themovable member 2 shown in FIG. 6 and the flexible print substrateconnected to the circuit board as viewed in the direction X. In FIG. 10,a part of the flexible print substrates is shown by a broken line inorder to facilitate understanding.

As shown in FIGS. 10 and 7, the flexible print substrate 25 includes afirst portion 25 a (broken line portion) extending in the up directionof the direction Y from the connector 21 b and a folded portion 25 b(solid line portion) folded in the down direction of the direction Y atan end portion of the first portion 25 a.

Although not shown in FIG. 10, the flexible print substrate 26 has thesame configuration as that of the flexible print substrate 25, andincludes a first portion 26 a extending in the up direction of thedirection Y from the connector 21 a and a folded portion 26 b folded inthe down direction of the direction Y at an end portion of the firstportion 26 a, as shown in FIG. 7.

As shown in FIGS. 10 and 7, the flexible print substrate 27 includes afixed portion 27 a which is fixed to the base 22, and includes a secondportion 270 (broken line portion) which extends in the down direction ofthe direction Y, and a folded portion 271 (solid line portion) folded inthe up direction of the direction Y at an end portion of the secondportion 270.

The non-fixed portion 27 b shown in FIG. 7 is constituted by a portionexcluding the fixed portion 27 a of the second portion 270 and thefolded portion 271.

A distal end of the folded portion 25 b, a distal end of the foldedportion 26 b, and a distal end of the folded portion 271 are connectedto a connector of a main substrate (a substrate on which the systemcontroller 108 is formed) (not shown) in the digital camera 100.

Next, details of the arrangement of the magnets fixed to the firstsupport member 1A shown in FIG. 4 will be described.

FIG. 11 is a front view of the first support member 1A shown in FIG. 4as viewed in the direction Z from the imaging optical system 101 side.

In the image shake correction device 3, six magnets are fixed to thebase 10 of the first support member 1A, as shown in FIG. 11. Thus, thearrangement of the magnets is devised such that the magnetic fields ofthese six magnets do not influence the magnetic fields of the othermagnets.

Specifically, in a case where two adjacent magnets among all the magnets(the X-axis rotation drive magnet Mv1, the X-axis rotation drive magnetMv2, the Y-axis drive magnet Mv3, the X-axis position detection magnetMh1, the Y-axis rotation position detection magnet Mh2, and the Y-axisrotation position detection magnet Mh3) fixed to the first supportmember 1A are focused, the same poles of the two magnets face eachother.

In a case where two magnets are adjacent to each other, in the frontview of FIG. 11, a length of the shortest line segment connecting theperipheral edges of the two magnets is short to the extent that themagnetic field of one of the two magnets influences the magnetic fieldof the other magnet.

In the example shown in FIG. 11, the X-axis rotation drive magnet Mv1and the Y-axis rotation position detection magnet Mh2 are adjacent toeach other, and the N-pole 2 n of the X-axis rotation drive magnet Mv1and the N-pole 2 n of the Y-axis rotation position detection magnet Mh2face each other.

In the example shown in FIG. 11, the X-axis position detection magnetMh1 and the Y-axis rotation position detection magnet Mh3 are adjacentto each other, and the S-pole 1 s of the X-axis position detectionmagnet Mh1 and the S-pole 3 s of the Y-axis rotation position detectionmagnet Mh3 face each other.

In the example shown in FIG. 11, the X-axis position detection magnetMh1 and the Y-axis rotation position detection magnet Mh2 are adjacentto each other, and the N-pole 1 n of the X-axis position detectionmagnet Mh1 and the N-pole 2 n of the Y-axis rotation position detectionmagnet Mh2 face each other.

In the example shown in FIG. 11, the Y-axis rotation position detectionmagnet Mh2 and the X-axis rotation drive magnet Mv2 are adjacent to eachother, and the S-pole 2 s of the X-axis rotation driving of the Y-axisrotation position detection magnet Mh2 and the S-pole of the X-axisrotation drive magnet Mv2 face each other.

In the example shown in FIG. 11, the X-axis rotation drive magnet Mv2and the Y-axis drive magnet Mv3 are adjacent to each other, and theS-pole of the X-axis rotation drive magnet Mv2 and the S-pole of theY-axis drive magnet Mv3 Are face each other.

The image shake correction device 3 detects the rotation position of themovable member 2 in the direction θ by the two magnets of the Y-axisrotation position detection magnet Mh2 and the Y-axis rotation positiondetection magnet Mh3 and the Y-axis rotation position detection Hallelement H2 and the Y-axis rotation position detection Hall element H3facing the two magnets.

Thus, it is important to uniformize the detection accuracy of the Y-axisrotation position detection Hall element H2 and the Y-axis rotationposition detection Hall element H3. The changes of the output signals ofthe Y-axis rotation position detection Hall element H2 and the Y-axisrotation position detection Hall element H3 in a case where the movablemember 2 is rotated need to be equal.

Therefore, as shown in FIG. 11, the Y-axis rotation position detectionmagnet Mh2 and the Y-axis rotation position detection magnet Mh3 arearranged symmetrically with respect to a straight line L2 that passesthrough the center P of the light receiving surface 20 a of the imager20 and extends in the direction Y.

The N-pole 2 n and the S-pole 2 s of the Y-axis rotation positiondetection magnet Mh2 are arranged symmetrically with respect to astraight line L3 that passes through the center P of the light receivingsurface 20 a of the imager 20 and extends in the direction X. The N-pole3 n and the S-pole 3 s of the Y-axis rotation position detection magnetMh3 are arranged symmetrically with respect to the straight line L3.

Distances between the N-pole 2 n and the S-pole 2 s and the straightline L3 and distances between the N-pole 3 n and the S-pole 3 s and thestraight line L3 are all the same.

In order to uniformize the influence of the magnetic field of the X-axisposition detection magnet Mh1 on the magnetic field of the Y-axisrotation position detection magnet Mh2 and the magnetic field of theY-axis rotation position detection magnet Mh3, the S-pole is and theN-pole 1 n of the X-axis position detection magnet Mh1 are arrangedsymmetrically with respect to the straight line L2.

In order to prevent the magnetic field of the Y-axis drive magnet Mv3from influencing the magnetic field of the X-axis position detectionmagnet Mh1, the X-axis position detection magnet Mh1 is disposed on theup direction side of the direction Y with respect to the straight lineL3, and the Y-axis drive magnet Mv3 is disposed on the down directionside of the direction Y with respect to the straight line L3.

In order to reduce the influence of the magnetic fields of the X-axisrotation drive magnet Mv1 and the X-axis rotation drive magnet Mv2 onthe magnetic field of the Y-axis rotation position detection magnet Mh2,the X-axis rotation drive magnet Mv1 and the X-axis rotation drivemagnet Mv2 are arranged symmetrically with respect to the straight lineL3.

In order to uniformize rotation drive forces in one direction and theother direction of the direction θ of the movable member 2, the X-axisrotation drive magnet Mv1 and the X-axis rotation drive magnet Mv2 havethe same configuration.

Meanwhile, in a case where the digital camera 100 is in the normalposture (the posture in which the direction Y and the gravity directionare parallel), the Y-axis drive magnet Mv3 having a plane area greaterthan each of the X-axis rotation drive magnet Mv1 and the X-axisrotation drive magnet Mv2 is used in order to obtain a sufficient driveforce for moving the movable member 2 against the gravity applied to themovable member 2.

The X-axis rotation drive magnet Mv1, the X-axis rotation drive magnetMv2, and the Y-axis drive magnet Mv3 need a large magnetic force inorder to move the movable member 2.

Thus, it is preferable that thicknesses of the X-axis rotation drivemagnet Mv1, the X-axis rotation drive magnet Mv2, and the Y-axis drivemagnet Mv3 are greater than thicknesses of the position detectionmagnets (the X-axis position detection magnet Mh1, the Y-axis rotationposition detection magnet Mh2, and the Y-axis rotation positiondetection magnet Mh3) of the movable member 2.

In the image shake correction device 3 having the aforementionedconfiguration, the drive magnets (the X-axis rotation drive magnet Mv1,the X-axis rotation drive magnet Mv2, and the Y-axis drive magnet Mv3)of the movable member 2 and the position detection magnets (the X-axisposition detection magnet Mh1, the Y-axis rotation position detectionmagnet Mh2, and the Y-axis rotation position detection magnet Mh3) ofthe movable member 2 are individually provided. Thus, the positiondetection accuracy of the movable member 2 can be improved.

In a case where two adjacent magnets among the six magnets fixed to thefirst support member 1A are focused, the same poles of the two magnetsface each other. Thus, the same poles of the two adjacent magnets do notattract each other, and a decrease in the magnetic force of each of thetwo magnets can be prevented.

As described above, according to the image shake correction device 3,decreases in the magnetic forces of the drive magnets (the X-axisrotation drive magnet Mv1, the X-axis rotation drive magnet Mv2, and theY-axis drive magnet Mv3) of the movable member 2 can be prevented.

It is possible to stabilize the magnetic fields applied to the X-axisrotation drive coil C1, the X-axis rotation drive coil C2, and theY-axis rotation drive coil C3, and it is possible to improve the driveperformance of the movable member 2.

According to the image shake correction device 3, it is possible toprevent decreases of the magnetic forces of the position detectionmagnets (the X-axis position detection magnet Mh1, the Y-axis rotationposition detection magnet Mh2, and the Y-axis rotation positiondetection magnet Mh3) of the movable member 2.

Thus, it is possible to stabilize the magnetic fields applied to theX-axis position detection Hall element H1, the Y-axis rotation positiondetection Hall element H2, and the Y-axis rotation position detectionHall element H3, and it is possible to improve the position detectionaccuracy of the movable member 2.

In the image shake correction device 3, the movable member 2 is drivensuch that the position of the movable member 2 becomes a desiredposition. Thus, the improvement of the position detection accuracy ofthe movable member 2 is particularly important for improving the imageshake correction performance.

In the image shake correction device 3, the Y-axis rotation positiondetection magnet Mh2 and the Y-axis rotation position detection magnetMh3 are arranged symmetrically with respect to the straight line L2, andthe Y-axis rotation position detection magnets Mh2 and Mh3 are arrangedsuch that two magnetic poles are symmetrically with respect to thestraight line L3.

Therefore, it is possible to uniformize the detection accuracy of theY-axis rotation position detection Hall element H2 and the Y-axisrotation position detection Hall element H3, and it is possible touniformize the changes of the output signals of the Y-axis rotationposition detection Hall element H2 and the Y-axis rotation positiondetection Hall element H3 in a case where the movable member 2 isrotated.

In the image shake correction device 3, the two magnetic poles of theX-axis position detection magnet Mh1 are arranged symmetrically withrespect to the straight line L2. Thus, the influence of the magneticfield of the X-axis position detection magnet Mh1 on the magnetic fieldof the Y-axis rotation position detection magnet Mh2 and the magneticfield of the Y-axis rotation position detection magnet Mh3 can beuniformized.

Due to these effects, it is possible to improve the position detectionaccuracy (particularly the detection accuracy of the rotation positionin the direction θ) of the movable member 2.

In the image shake correction device 3, the X-axis position detectionmagnet Mh1 is disposed on the up direction side in the direction Y withrespect to the straight line L3, and the Y-axis drive magnet Mv3 isdisposed on the down direction side in the direction Y with respect tothe straight line L3.

Thus, it is possible to prevent the magnetic field of the Y-axis drivemagnet Mv3 from influencing the magnetic field of the X-axis positiondetection magnet Mh1. As a result, the position detection accuracy ofthe movable member 2 can be improved.

In the image shake correction device 3, the X-axis rotation drive magnetMv1 and the X-axis rotation drive magnet Mv2 are arranged symmetricallywith respect to the straight line L3. Thus, it is possible to reduce theinfluence of the magnetic fields of the X-axis rotation drive magnet Mv1and the X-axis rotation drive magnet Mv2 on the magnetic field of theY-axis rotation position detection magnet Mh2. As a result, the positiondetection accuracy of the movable member 2 can be improved.

In the image shake correction device 3, the plane area of the Y-axisdrive magnet Mv3 is greater than the plane areas of the X-axis rotationdrive magnet Mv1 and the X-axis rotation drive magnet Mv2. Thus, in astate in which the digital camera 100 is in the normal posture, thedrive force in the direction Y of the movable member 2 can besufficiently secured.

The position detection magnets (the X-axis position detection magnetMh1, the Y-axis rotation position detection magnet Mh2, and the Y-axisrotation position detection magnet Mh3) of the movable member 2 of theimage shake correction device 3 are arranged such that the S-poles andthe N-poles are arranged with a space.

The S-poles and the N-poles of the X-axis position detection magnet Mh1,the Y-axis rotation position detection magnet Mh2, and the Y-axisrotation position detection magnet Mh3 may be integrated. However, theS-pole and the N-pole are separated, and thus, the position detectionaccuracy by the Hall elements can be improved. A range in which theposition of the Hall element can be detected can be widened.

Although the image shake correction device 3 performs the image shakecorrection by moving the movable member 2 in three directions, that is,the direction X, the direction Y, and the direction θ, it is possible toimprove the position detection accuracy and the drive performance byarranging the same poles of the two adjacent magnets so as to face eachother as described above even though the image shake correction isperformed by moving the movable member 2 in two directions of thedirection X and the direction Y.

For example, in a case where the image shake correction device 3 doesnot to move the movable member 2 in the direction θ, the pair of theY-axis rotation position detection magnet Mh2 and the Y-axis rotationposition detection Hall element H2 may be removed, and the pair of theX-axis rotation drive magnet Mv1 and the X-axis rotation drive coil C1may be removed.

In this configuration, the X-axis rotation drive magnet Mv2 functions asthe first drive magnet, the Y-axis rotation drive magnet Mv3 functionsas the second drive magnet, the X-axis position detection magnet Mh1functions as the first position detection magnet, and the Y-axisrotation position detection magnet Mh3 functions as the second positiondetection magnet.

Even in this configuration, the same poles of the two adjacent magnetsare arranged to face each other, and thus, the influence of each magneton the magnetic field of the other magnet is reduced. Accordingly, it ispossible to improve the position detection accuracy and driveperformance.

The image shake correction device 3 has a configuration in which themagnets are fixed to the first support member 1A and the drive coils andthe position detectors facing the magnets are fixed to the movablemember 2. However, the effects described above can be similarly obtainedeven in the configuration in which the magnets are fixed to the movablemember 2, and the X-axis rotation drive coil C1, the X-axis rotationdrive coil C2, the Y-axis drive coil C3, the X-axis position detectionHall element H1, the Y-axis rotation position detection Hall element H2,and the Y-axis rotation position detection Hall element H3 are fixed tothe first support member 1A.

Although the image shake correction device 3 corrects image shake bymoving the imager 20, the arrangement of the magnets is effective evenin the device that corrects image shake by moving the lens included inthe imaging optical system 101. Specifically, in the image shakecorrection device having the movable member to which the lens is fixedand the support member that supports the movable member to be movable,the arrangement of the plurality of drive magnets and the plurality ofposition detection magnets fixed to any of the movable member and thesupport member may be the arrangement in which the same poles of the twoadjacent magnets face each other, as shown in FIG. 11.

As shown in FIGS. 7, 8, and 10, in the image shake correction device 3,the flexible print substrate 25 and the flexible print substrate 26 aredrawn in the up direction of the direction Y and then is folded in thedown direction of the direction after upward in the direction Y, and theflexible print substrate 27 is drawn in the down direction of thedirection Y and then is folded in the up direction of the direction Y.

For example, the widths or thicknesses of the flexible print substrates25 to 27 are adjusted such that the total of the elastic force appliedto the movable member 2 from the flexible print substrate 25 and theflexible print substrate 26 toward the down direction of the direction Yand the gravity applied to the movable member 2 in a case where thedigital camera 100 is in the normal posture is the same as the elasticforce applied to the movable member 2 from the flexible print substrate27 toward the up direction of the direction Y.

By doing this, in a case where the digital camera 100 is in the normalposture, the power for holding the movable member 2 at a position of areference posture can be reduced.

In the image shake correction device 3, it is preferable that theflexible print substrate 25 and the flexible print substrate 26 includewirings connected to terminals other than the power supply terminal andthe ground terminal among the terminals of the imager 20 and theflexible print substrate 27 includes wirings (power supply line andground line) connected to the power supply terminal and the groundterminal among the terminals of the imager 20.

The flexible print substrate having a less thickness can have a lowerelastic force. However, it is necessary to increase the widths of thepower supply line and the ground line in order to reduce thethicknesses. Meanwhile, in a case where the width of the flexible printsubstrate is increased, the spring multiplier of the flexible printsubstrate is increased.

According to the aforementioned preferred configuration, the flexibleprint substrate 25 and the flexible print substrate 26 do not includethe power supply line and the ground line, and thus, the widths of theflexible print substrate 25 and the flexible print substrate 26 are notincreased. As a result, the flexible print substrate 25 and the flexibleprint substrate 26 are thinned, and thus, it is possible to reduce theelastic force of the flexible print substrate 25 and the flexible printsubstrate 26.

As described above, the elastic force of the flexible print substrate 25and the flexible print substrate 26 is reduced, and thus, the elasticforce of the flexible print substrate 27 necessary for canceling theresultant force of the elastic force and the gravity can be reduced.

As a result, degrees of freedom in designing the flexible printsubstrates 25 to 27 are increased, and thus, the manufacturing cost ofthe image shake correction device 3 can be reduced.

According to the aforementioned preferred configuration, the elasticforce by the flexible print substrates 25 to 27 can be reduced. Thus,the power required for driving the movable member 2 can be reduced, orthe drive response of the movable member 2 can be improved.

According to the aforementioned preferable configuration, the flexibleprint substrates 25 and 26 do not include the power supply line and theground line. Thus, it is possible to prevent power supply noise frombeing mixed into the imaging signals output via the flexible printsubstrates 25 and 26, and it is possible to improve the quality of thecaptured image.

In a case where the flexible print substrate 27 includes the powersupply line and the ground line, the thickness of the flexible printsubstrate 27 may be greater than the thickness of each of the flexibleprint substrate 25 and the flexible print substrate 26.

As described above, the width of the flexible print substrate 27 can beprevented from being increased by increasing the thickness of theflexible print substrate 27 including the power supply line and theground line, and the size of the image shake correction device 3 can bereduced.

Since the width of the flexible print substrate 27 is reduced and thespring multiplier can be reduced, it is possible to more easily designthe flexible print substrate 27.

It is preferable that the flexible print substrate 27 includes wiringsconnected to the X-axis rotation drive coil C1, the X-axis rotationdrive coil C2, and the Y-axis drive coil C3 in addition to the powersupply line, the ground line, and the wirings connected to the X-axisrotation position detection Hall element H1, the Y-axis rotationposition detection Hall element H2, and the Y-axis rotation positiondetection Hall element H3.

According to this configuration, the flexible print substrate 25 and theflexible print substrate 26 include only wirings of a signal processingsystem necessary for imaging, and the flexible print substrate 27includes only wiring necessary for driving the movable member 2.

As described above, the wirings of the signal processing system and thewirings of the driving system are formed on different substrates, andthus, the quality of the captured image can be improved, and the driveperformance of the movable member 2 can be improved.

The effects obtained by the preferred configurations of the flexibleprint substrates 25 to 27 can be similarly obtained even in the imageshake correction device 3 that can move the movable member 2 only in thetwo directions of the direction X and the direction Y. In a case wherethe movable member 2 moves in three directions, since the movable member2 becomes heavier, the configurations of the flexible print substrates25 to 27 are particularly effective.

Next, the details of the two movement restriction units MR1 and MR2provided in the image shake correction device 3 will be described.

FIG. 12 is a schematic diagram showing the first support member 1A shownin FIG. 5 as viewed in the direction Z from the side opposite to theimaging optical system 101 side.

FIG. 12 is an enlarged view of a portion at which the through-holes 11 aand 11 b of the first support member 1A are formed, and this portion isschematically shown by a rectangle. In FIG. 12, the screws SC1 to SC4shown in FIG. 5 are not shown.

FIG. 12 shows the Y-axis rotation position detection Hall elements H2and H3 fixed to the movable member 2 located on the depth side of thepaper surface and the insertion members 28 a and 28 b inserted into thethrough-holes 11 a and 11 b formed in the movable member 2.

As shown in FIG. 12, in the reference state, the center of the insertionmember 28 a is located at the center of the through-hole 11 a, and thecenter of the insertion member 28 b is located at the center of thethrough-hole 11 b.

As shown in FIG. 12, the through-hole 11 a of the movement restrictionunit MR1 and the through-hole 11 b of the movement restriction unit MR2are substantially square.

FIG. 13 is an enlarged view of the through-hole 11 a shown in FIG. 12. Ashape of the through-hole 11 b is the same as that of the through-hole11 a.

As shown in FIG. 13, the through-hole 11 a includes four sides 110, 111,113, and 114 having the same length, a curve 115 that connects the side110 and the side 113, a curve 116 that connects the side 113 and theside 111, a curve 117 that connects the side 111 and the side 114, and acurve 118 that connects the side 114 and the side 110.

The sides 110 and 111 are parallel to the direction X.

The sides 113 and 114 are parallel to the direction Y. A distancebetween the side 113 and the side 114 and a distance between the side110 and the side 111 are the same.

The curves 115 to 118 are arcs of a circle using a center 110 p of thethrough-hole 11 a with a center.

Lengths of line segments of the curves 115 to 118 are sufficientlysmaller than the lengths of the sides 110 to 114. Specifically, thelengths of the line segments of the curves 115 to 118 are 1/10 or lessof the lengths of the sides 110 to 114.

As stated above, the through-hole 11 a (or the through-hole 11 b)becomes a substantial square by slightly rounding the four corners ofthe square, but may be a perfect square.

In FIG. 13, a diagonal line of the square which is the shape of thethrough-hole 11 a (or the through-hole 11 b) is indicated by a one-dotchain line. This diagonal line is a portion overlapping the through-hole11 a (or the through-hole 11 b) among straight lines connecting anintersection of an extension line of the side 110 and an extension lineof the side 114 and an intersection of an extension line of the side 113and an extension line of the side 111.

As shown in FIG. 12, in a state in which the insertion members 28 a and28 b are present at the centers of the through-holes 11 a and 11 b (theaforementioned reference state), a diagonal line (second diagonal line)of the through-hole 11 b overlaps an extension line L4 of the diagonalline (first diagonal line) of the through-hole 11 a. The center P of thelight receiving surface 20 a overlaps a line connecting the diagonalline of the through-hole 11 a and the diagonal line of the through-hole11 b.

As shown in FIG. 12, a distance Lx1 in the direction X between themovement restriction unit MR1 and the movement restriction unit MR2 isthe same as a distance Ly in the direction Y between the movementrestriction unit MR1 and the movement restriction unit MR2.

The distance Lx1 and the distance Ly are equal to or greater than 0.75times and are equal to or less than 1.25 times of a distance Lx2 in thedirection Y between the Y-axis rotation position detection Hall elementH2 and the Y-axis rotation position detection Hall element H3.

The distance Lx1 refers to a distance between the centers of thethrough-hole 11 a and the through-hole 11 b, or a distance between thecenters of the insertion member 28 a and the insertion member 28 b. Thedistance Ly refers to the distance between the centers of thethrough-hole 11 a and the through-hole 11 b, or the distance between thecenters of the insertion member 28 a and the insertion member 28 b.

As described above, in the image shake correction device 3, the diagonalline of the through-hole 11 b overlaps the extension line L4 of thediagonal line of the through-hole 11 a, and the center P of the lightreceiving surface 20 a overlaps the extension line L4. Thus, theinsertion member 28 a moves along a circumference of a circle of which aline connecting the center P and the insertion member 28 a is used as aradius. Since this circle passes through the vicinity of the diagonalline of the through-hole 11 a, the movement amount of the insertionmember 28 a can be maximized.

Similar1 y, since the insertion member 28 b moves along a circumferenceof a circle of which a line connecting the center P and the insertionmember 28 b is used as a radius, the movement amount can be maximized.As a result, the rotatable amount of the movable member 2 can bemaximized, and the image shake correction performance can be improved.

In the image shake correction device 3, each of the distance Lx1 and thedistance Ly is equal to or greater than 0.75 times and is equal to orless than 1.25 times the distance Lx2. The distance Lx1 and the distanceLy are each a first distance, and the distance Lx2 is a second distance.

As stated above, the distance Lx1, the distance Ly, and the distance Lx2are close to each other, and thus, the movement amounts of the insertionmembers 28 a and 28 b in a case where the movable member 2 is rotated,and the movement amounts of the Y-axis rotation position detection Hallelements H2 and h3 with respective to the Y-axis rotation positiondetection magnets Mh2 and Mh3 can be close to each other. Accordingly,it is possible to increase the position detection accuracy of themovable member 2 in the direction θ.

In the movement restriction units MR1 and MR2 shown in FIG. 12, the sameeffects can be obtained even though the through-holes 11 a and 11 b arechanged to the recess portions formed in the surface of the movablemember 2 side of the base 10.

The movement restriction unit MR1 may be configured such that thethrough-hole 11 a or the recess portion is formed in the flat plateportion 280 a of the movable member 2 and the insertion member 28 ainserted into the through-hole 11 a or the recess portion is formed aton the surface of the movable member 2 of the base 10 of the firstsupport member 1A.

Similar1 y, the movement restriction unit MR2 may be configured suchthat the through-hole 11 b or the recess portion formed in the flatplate portion 280 b of the movable member 2 and the insertion member 28b inserted into the through-hole 11 b or the recess portion is formed onthe surface of the movable member 2 side of the base 10 of the firstsupport member 1A.

In these configurations, the rotation amount of the movable member 2 canbe maximized by adopting the planar shape of the through-hole or therecess portion and the arrangement of the two through-holes or recessportions as the configuration shown in FIG. 12.

The planar shapes of the through-holes 11 a and 11 b of the movementrestriction units MR1 and MR2 of the image shake correction device 3 arenot square, and may be a rectangle as shown in FIG. 14. That is, in acase where the planar shapes of the through-holes 11 a and 11 b arerectangular, the aforementioned arrangement is effective.

FIG. 14 is a diagram showing a modification example of the movementrestriction units MR1 and MR2 shown in FIG. 12. In the example shown inFIG. 14, the planar shapes of the through-holes 11 a and 11 b of themovement restriction units MR1 and MR2 are rectangles including twosides parallel to the direction X and two sides parallel to thedirection Y.

The diagonal line of the through-hole 11 b overlaps the extension lineL4 of the diagonal line of the through-hole 11 a, and the center P ofthe light receiving surface 20 a of the imager 20 overlaps the lineconnecting the diagonal line of the through-hole 11 a and the diagonalline of the through-hole 11 b.

Thus, in a case where the shapes of the through-holes 11 a and 11 b arerectangles, the rotation amount of the movable member 2 can be maximizedby adopting the configuration shown in FIG. 14. In FIG. 14, the fourcorners of the planar shapes of the through-holes 11 a and 11 b may berounded.

Next, a modification example of a configuration of each pair of thehooks 16 a to 16 c formed at the first support member 1A of the imageshake correction device 3 and the hooks 23 a to 23 c of the movablemember 2 facing the hooks 16 a to 16 c will be described.

FIG. 15 is a diagram showing a modification example of the first supportmember 1A shown in FIG. 11.

The first support member 1A shown in FIG. 15 has the same configurationas that of FIG. 11 except that the hook 16 a is changed to a hook 160 a,the hook 16 b is changed to a hook 160 b, and the hook 16 c is changedto a hook 160 c.

The hook 160 a has the same function as the hook 16 a, but the extendingdirection is changed. The hook 160 b has the same function as the hook16 b, but the extending direction is changed. The hook 160 c has thesame function as the hook 16 c, but the extending direction is changed.

FIG. 15 shows a first extension line L5 which is an extension line of aline connecting a distal end and a base end (a boundary portion with thebase 10) of the hook 160 a, a second extension line L6 which is anextension line of a line connecting a distal end and a base end (aboundary portion with the base 10) of the hook 160 b, and a thirdextension line L7 which is an extension line of a line connecting adistal end and a base end (a boundary portion with the base 10) of thehook 160 c.

As shown in FIG. 15, the first extension line L5, the second extensionline L6, and the third extension line L7 overlap the center P of thelight receiving surface 20 a of the imager 20.

FIG. 16 is a diagram showing a modification example of the movablemember 2 shown in FIG. 8.

The movable member 2 shown in FIG. 16 has the same configuration as thatof FIG. 8 except that the hook 23 a is changed to a hook 230 a, the hook23 b is changed to a hook 230 b, and the hook 23 c is changed to a hook230 c. FIG. 16 shows the first extension line L5, the second extensionline L6, and the third extension line L7 shown in FIG. 15.

The hook 230 a has the same function as the hook 23 a, but the extendingdirection is changed. The hook 230 b has the same function as the hook23 b, but the extending direction is changed. The hook 230 c has thesame function as the hook 23 c, but the extending direction is changed.

The extending direction of the hook 230 a matches the extendingdirection of the hook 160 a shown in FIG. 15. The line connecting thedistal end and the base end of the hook 230 a and the center P overlapsthe first extension line L5.

The extending direction of the hook 230 b matches the extendingdirection of the hook 160 b shown in FIG. 15. The line connecting thedistal end and the base end of the hook 230 b and the center P overlapsthe second extension line L6.

The extending direction of the hook 230 c matches the extendingdirection of the hook 160 c shown in FIG. 15. The line connecting thedistal end and the base end of the hook 230 c and the center P overlapsthe third extension line L7.

In the modification examples shown in FIGS. 15 and 16, the hook 160 aconstitutes a first support side locking portion, the hook 160 bconstitutes a second support side locking portion, and the hook 160 cconstitutes a third support side locking portion.

In the modification examples shown in FIGS. 15 and 16, the hook 230 aconstitutes a first movable side locking portion, the hook 230 bconstitutes a second movable side locking portion, and the hook 230 cconstitutes a third movable side locking portion.

The spring 24 a shown in FIG. 3 that is locked to the hook 160 a and thehook 230 a constitutes a first elastic member. The spring 24 b shown inFIG. 3 that is locked to the hook 160 b and the hook 230 b constitutes asecond elastic member. The spring 24 c shown in FIG. 3 that is locked tothe hook 160 c and the hook 230 c constitutes a third elastic member.

According to the image shake correction device 3 including the hooks 160a to 160 c and the hooks 230 a to 230 c of the modification example asshown in FIGS. 15 and 16, in a case where the movable member 2 isrotated around the rotation axis R, the elastic force of the spring 24 alocked to the hook 160 a and the hook 230 a, the elastic force of thespring 24 b locked to the hook 160 b and the hook 230 b, and the elasticforce of the spring 24 c locked to the hook 160 c and the hook 230 c aregenerated only in the rotation direction of the movable member 2.

Accordingly, the drive response in a case where the movable member 2 isrotationally driven can be improved by determining the distances of thesprings 24 a to 24 c from the center P and the multiplier of the springs24 a to 24 c such that the elastic forces of the springs 24 a to 24 care equal for each spring in a case where the movable member 2 isrotated.

As described above, in a case where the movable member 2 is rotated,since it is not necessary to design the springs 24 a to 24 c withconsideration for the elastic force in the rotation direction, it ispossible to easily design the image shake correction device 3.

FIG. 17 is a diagram showing a modification example of the arrangementof the hooks 160 a to 160 c in the base 10 shown in FIG. 15. In FIG. 17,only the outer edge of the base 10 is shown.

In the example shown in FIG. 17, a case where the center P is present onthe extension lines connecting the distal ends and the base ends of thehooks 160 a to 160 c is the same as that in FIG. 15, but theinstallation locations of the hooks 160 a to 160 c are different fromthose in FIG. 15.

In the example shown in FIG. 17, the hooks 160 a to 160 c are formed onthe base 10 such that the figures connecting the portions of the hooks160 a to 160 c to which the springs are locked form an equilateraltriangle TR. The center P of the light receiving surface 20 a overlapsthe center of the equilateral triangle TR.

The hooks 230 a to 230 c of the movable member 2 are formed on the base22 in the same direction as the hooks 160 a to 160 c at positions ofvertices of the equilateral triangle TR.

As described above, the hooks 160 a to 160 c and the hooks 230 a to 230c are arranged so as to overlap the vertices of the equilateral triangleTR, and thus, the distances between the springs 24 a to 24 c and thecenter P can be uniformized. As a result, it is possible to more easilydesign the springs 24 a to 24 c.

The resultant force of the elastic forces applied to the movable member2 from the springs 24 a to 24 c in a case where the movable member 2moves in the direction X or the direction Y can be made zero, and thedrive response of the movable member 2 in the direction X and thedirection Y can be improved.

Although it has been described in FIGS. 15 to 17 that there are threepairs of the hooks formed on the first support member 1A and the hooksformed on the movable member 2 facing the hooks, four or more pairs maybe used.

FIG. 18 is a view showing another modification example of the firstsupport member 1A shown in FIG. 11. In FIG. 18, only the outer edge ofthe base 10 is shown.

The first support member 1A shown in FIG. 18 has the same configurationof FIG. 11 except that the hook 16 a is changed to the hook 160 a, thehook 16 b is changed to the hook 160 b, the hook 16 c is changed to thehook 160 c, and a hook 160 d is further added.

Although not shown, a hook having the same shape as the hook 160 aextending in the same direction as the hook 160 a is formed at the base22 of the movable member 2 at a position facing the hook 160 a.

A hook having the same shape as the hook 160 b extending in the samedirection as the hook 160 b is formed at the base 22 of the movablemember 2 at a position facing the hook 160 b.

A hook having the same shape as the hook 160 c extending in the samedirection as the hook 160 c is formed at the base 22 of the movablemember 2 at a position facing the hook 160 c.

A hook having the same shape as the hook 160 d extending in the samedirection as the hook 160 d is formed at the base 22 of the movablemember 2 at a position facing the hook 160 d.

Spring are locked to the hooks 160 a to 160 d and the hooks of themovable member 2 facing the hooks, and the movable member 2 is biased tothe first support member 1A by these four springs.

In this modification example, the hook 160 d constitutes a fourthsupport side locking portion. The hook of the movable member 2 facingthe hook 160 d constitutes a fourth movable side locking portion. Thespring locked to the hook 160 d and the hook of the movable member 2facing this hook constitutes a fourth elastic member.

FIG. 18 shows the first extension line L5 which is the extension line ofthe line connecting the distal end and the base end (the boundaryportion with the base 10) of the hook 160 a, the second extension lineL6 which is the extension line of the line connecting the distal end andthe base end (the boundary portion with the base 10) of the hook 160 b,the third extension line L7 which is the extension line of the lineconnecting the distal end and the base end (the boundary portion withthe base 10) of the hook 160 c, and the fourth extension line L8 whichis the extension line of the line connecting the distal end and the baseend (the boundary portion with the base 10) of the hook 160 d.

As shown in FIG. 18, the first extension line L5, the second extensionline L6, the third extension line L7, and the fourth extension line L8overlap the center P of the light receiving surface 20 a of the imager20.

As stated above, the number of hook pairs is four, and thus, it ispossible to urge the movable member 2 against the first support member1A with more stable force.

The first extension line L5, the second extension line L6, the thirdextension line L7, and the fourth extension line L8 overlap the centerP. With this configuration, when the movable member 2 is rotated, it isnot necessary to design the spring with consideration for a spring forcein the rotation direction. Thus, it is possible to easily design theimage shake correction device 3.

As shown in FIG. 18, in a case where the image shake correction device 3includes four hook pairs, it is possible to easily design the springs byproviding the hooks 160 a to 160 d at the base 10 such that the figuresconnecting the portions to which the springs of the four pairs arelocked forms a square. The drive response of the movable member 2 in thedirection X and the direction Y can be improved.

The first extension line L5, the second extension line L6, the thirdextension line L7, and the fourth extension line L8 shown in FIGS. 15 to18 may overlap the center of gravity of the movable member 2.

In the movable member 2, the imager 20 and the circuit board 21 areheavy. Thus, the center of gravity of the movable member 2 and thecenter P of the light receiving surface 20 a are close in many cases.

In a case where there is a restriction on the direction of the hook inthe design, it is possible to expect the same effects as in a case wherethe center P and the extension lines overlap by providing the hooks suchthat the centers of gravity and the extension lines overlap.

As shown in FIG. 7, the image shake correction device 3 is configuredsuch that the position detectors such as the X-axis position detectionHall element H1, the Y-axis rotation position detection Hall element H2,and the Y-axis rotation position detection Hall element H3 are fixed tothe rear surface of the circuit board 21.

A large number of circuit elements constituting a circuit connected tothe terminals of the imager 20 and a circuit connected to the terminalsof the connectors 21 a to 21 c are formed on the rear surface of thecircuit board 21.

These circuit elements include capacitors, resistors, thermistors, oroscillators. Magnetic materials are included in plating that covers theterminals of these circuit elements or these circuit elements.

Hereinafter, a preferable example of the arrangement of the circuitelement including the magnetic materials on the rear surface of thecircuit board 21 will be described.

FIG. 19 is a schematic diagram showing a preferable configurationexample of the rear surface of the circuit board 21 in the image shakecorrection device 3.

FIG. 19 shows a state in which the circuit board 21 of the image shakecorrection device 3 is viewed in the direction Z from the rear surfaceside in the reference state. FIG. 19 shows the X-axis position detectionmagnet Mh1, the Y-axis rotation position detection magnet Mh2, and theY-axis rotation position detection magnet Mh3 that overlap the circuitboard 21.

As shown in FIG. 19, a first region ar1 (a region with diagonal lines)overlapping with the X-axis position detection magnet Mh1, a firstregion ar2 (a region with diagonal lines) overlapping the Y-axisrotation position detection magnet Mh2, and a first region ar3 (a regionwith diagonal lines) overlapping the Y-axis rotation position detectionmagnet Mh3 are present on the rear surface of the circuit board 21.

The first region ar1 is a region overlapping the magnet that suppliesthe magnetic field to the X-axis position detection Hall element H1, andindicates the N-pole 1 n, the S-pole 1 s, and a region in which a regionbetween the N-pole 1 n and the S-pole 1 s overlaps the circuit board 21.

The first region ar2 is a region overlapping the magnet that suppliesthe magnetic field to the Y-axis rotation position detection Hallelement H2, and indicates the N-pole 2 n, the S-pole 2 s, and a regionin which a region between the N-pole 2 n and the S-pole 2 s overlaps thecircuit board 21.

The first region ar3 is a region overlapping with the magnet thatsupplies the magnetic field to the Y-axis rotation position detectionHall element H3, and indicates the N-pole 3 n, the S-pole 3 s, and aregion in which a region between the N-pole 3 n and the S-pole 3 soverlaps the circuit board 21.

On the rear surface of the circuit board 21, a frame-shaped secondregion AR1 surrounding the first region ar1 is present around the firstregion ar1, a frame-shaped second region AR2 surrounding the firstregion ar2 is present around the first region ar2, and a frame-shapedsecond region AR3 surrounding the first region ar3 is present around thefirst region ar3.

In the second region AR2 and the second region AR3, a high-densityregion 210 b in which circuit elements are arranged is formed with adensity higher than a density of circuit elements arranged in theregions excluding the second regions AR1 to AR3 on the rear surface ofthe circuit board 21.

The high-density region 210 b formed in the second region AR2 isdisposed so as to be adjacent to an upper end portion of the firstregion ar2 in the direction Y.

The high-density region 210 b formed in the second region AR3 isdisposed so as to be adjacent to an upper end portion of the firstregion ar3 in the direction Y.

In the configuration example shown in FIG. 19, on the rear surface ofthe circuit board 21, the high-density region 210 b in which manycircuit elements are arranged than the other regions is present so as tobe adjacent to the directions Y of the first regions ar2 and ar3. Thus,an attractive force can be generated between a large amount of magneticmaterials included in the circuit elements formed in the high-densityregion 210 b and the Y-axis rotation position detection magnets Mh2 andMh3.

In a state in which the digital camera 100 is in the normal posture, themovable member 2 tends to move in the down direction of the direction Yin FIG. 19 due to gravity. However, the movable member 2 can be moved inthe up direction of the direction Y due to this attractive force.

Therefore, the attractive force between the high-density region 210 band the magnet is adjusted by adjusting the amount of magnetic materialsin the high-density region 210 b or the distance from the high-densityregion 210 b to the first regions ar2 to ar3, and thus, the movement ofthe movable member 2 due to gravity in the normal posture can bereduced. Accordingly, it is possible to reduce a power required toreturn the movable member 2 to the reference position.

FIG. 20 is a diagram showing a first modification example of the circuitboard 21 shown in FIG. 19.

The circuit board 21 shown in FIG. 20 has the same configuration as thatshown in FIG. 19 except that three high-density regions 210 b are addedto the second region AR1 and three high-density regions 210 b are addedto each of the second region AR2 and the second region AR3.

As shown in FIG. 20, in the second region AR1, the high-density region210 b is disposed so as to be adjacent to the end portion of the firstregion ar1 on the down direction side of the direction Y, and thehigh-density region 210 b is disposed so as to be adjacent to both endportions of the first region ar1 in the direction X.

In the second region AR2, the high-density region 210 b is disposed soas to be adjacent to both end portions of the first region ar2 in thedirection Y, and the high-density region 210 b is disposed so as to beadjacent to both end portions of the first region ar2 in the directionX.

In the second region AR3, the high-density region 210 b is disposed soas to be adjacent to both end portions of the first region ar3 in thedirection Y, and the high-density region 210 b is disposed so as to beadjacent to both end portions of the first region ar3 in the directionX.

According to the modification example shown in FIG. 20, the attractiveforce between the high-density region 210 b on a lower side of each ofthe first regions ar1 to ar3 and the magnet and the attractive forcebetween the high-density region 210 b on an upper side of each of thefirst regions ar2 to ar3 and the magnet are adjusted, and thus, themovable member 2 can be held at the reference position without drivingthe movable member 2 in a case where the digital camera 100 is in thenormal posture.

According to the modification example shown in FIG. 20, the attractiveforce between the high-density region 210 b on a left side of each ofthe first regions ar1 to ar3 and the magnet and the attractive forcebetween the high-density region 210 b on a right side of each of thefirst regions ar1 to ar3 and the magnet are adjusted, and thus, themovable member 2 can be held at the reference position without drivingthe movable member 2 even though the digital camera 100 is in a rotationposture (a posture in which the direction X is parallel to the gravity)which is rotated by 90 degrees from the normal posture.

Thus, the power required for driving the movable member 2 can be reducedin both the normal posture and the rotational posture.

The second region AR1 shown in FIGS. 19 and 20 is a range in which themagnetic force of the X-axis position detection magnet Mh1 sufficientlyreaches, and is, for example, a range to a position separated from theend portion of the first region ar1 in the direction X and the directionY by about 1 mm to 5 mm.

Similarly, the second region AR2 is a range in which the magnetic forceof the Y-axis rotation position detection magnet Mh2 sufficientlyreaches, and is, for example, a range separated from the end portion ofthe first region ar2 in the direction X and the direction Y by about 1mm to 5 mm.

Similarly, the second region AR3 is a range in which the magnetic forceof the Y-axis rotation position detection magnet Mh3 sufficientlyreaches, and is, for example, a range separated from the end portion ofthe first region ar3 in the direction X and the direction Y by about 1mm to 5 mm.

In the modification example shown in FIGS. 19 and 20, the attractiveforce between the magnetic materials and the magnet in the high-densityregion 210 b also functions as an urging force that urges the movablemember 2 against the first support member 1A.

Thus, the spring 24 a, the spring 24 b, and the spring 24 c shown inFIG. 3 may be removed by adjusting the attractive force. Accordingly, itis possible to reduce the size and cost of the image shake correctiondevice 3.

FIG. 21 is a diagram showing a second modification example of thecircuit board 21 shown in FIG. 19.

The circuit board 21 shown in FIG. 21 has the same configuration as thecircuit board 21 shown in FIG. 19 except that non-arrangement regionsAR6, AR7, and AR8 which are regions in which circuit elements are notarranged are formed around each of the first regions ar1 to ar3, theX-axis position detection Hall element H1, the Y-axis rotation positiondetection Hall element H2, and the Y-axis rotation position detectionHall element H3.

The non-arrangement region AR6 is a square using the X-axis positiondetection Hall element H1 as a center, and is a region where a squarehaving two sides parallel to the direction X and two sides parallel tothe direction Y and the first region ar1 overlap.

A length from the center of the X-axis position detection Hall elementH1 to an end portion of the non-arrangement region AR6 in the directionX is a value which is equal to or greater than 1.5 times of the maximummovement distance with which the movable member 2 can be moved in onedirection of the direction X.

A length from the center of the X-axis position detection Hall elementH1 to an end portion of the non-arrangement region AR6 in the directionY is a value which is equal to or greater than 1.5 times of the maximummovement distance with which the movable member 2 can be moved in onedirection of the direction Y.

The length from the center of the X-axis position detection Hall elementH1 to the end portion of the non-arrangement region AR6 in the directionX and the length from the center of the X-axis position detection Hallelement H1 to the end portion of the non-arrangement region AR6 in thedirection Y may be values which are equal to or greater than thedistance between the X-axis position detection Hall element H1 and theX-axis position detection magnet Mh1.

The non-arrangement region AR7 is a square using the Y-axis rotationposition detection Hall element H2 as a center, and is a region in whicha square having two sides parallel to the direction X and two sidesparallel to the direction Y and the first region ar2 overlap.

A length from the center of the Y-axis rotation position detection Hallelement H2 to an end portion of the non-arrangement region AR7 in thedirection X is a value which is equal to or greater than 1.5 times ofthe maximum movement distance with which the movable member 2 can bemoved in one direction of the direction X.

A length from the center of the Y-axis rotation position detection Hallelement H2 to an end portion of the non-arrangement region AR7 in thedirection Y is a value which is equal to or greater than 1.5 times ofthe maximum movement distance with which the movable member 2 can bemoved in one direction of the direction Y.

The length from the center of the Y-axis rotation position detectionHall element H2 to the end portion of the non-arrangement region AR7 inthe direction X and the length from the center of the Y-axis rotationposition detection Hall element H2 and the end portion of thenon-arrangement region AR7 in the direction Y may be values which areequal to or greater than the distance between the Y-axis rotationposition detection Hall element H2 and the Y-axis rotation positiondetection magnet Mh2.

The non-arrangement region AR8 is a square using the Y-axis rotationposition detection Hall element H3 as a center, and is a region in whicha square having two sides parallel to the direction X and two sidesparallel to the direction Y and the first region ar3 overlap.

A length from the center of the Y-axis rotation position detection Hallelement H3 to an end portion of the non-arrangement region AR8 in thedirection X is a value which is equal to or greater than 1.5 times ofthe maximum movement distance with which the movable member 2 can bemoved in one direction of the direction X.

A length from the center of the Y-axis rotation position detection Hallelement H3 to an end portion of the non-arrangement region AR8 in thedirection Y is a value which is equal to or greater than 1.5 times ofthe maximum movement distance with which the movable member 2 can bemoved in one direction of the direction Y.

The length from the center of the Y-axis rotation position detectionHall element H3 to the end portion the non-arrangement region AR8 in thedirection X of and the length from the center of the Y-axis rotationposition detection Hall element H3 and the end portion of thenon-arrangement region AR8 in the direction Y may be values which areequal to or greater than the distance between the Y-axis rotationposition detection Hall element H3 and the Y-axis rotation positiondetection magnet Mh3.

According to the modification example shown in FIG. 21, since a regionin which the circuit element including the magnetic materials is notdisposed is formed around each of the X-axis position detection Hallelement H1, the Y-axis rotation position detection Hall element H2, andthe Y-axis rotation position detection Hall element H3, it is possibleto stabilize the linearity of the output of each Hall element, and it ispossible to perform highly accurate position detection.

The modification example shown in FIG. 21 is also applicable to thecircuit board 21 shown in FIG. 20.

In the circuit board 21 shown in FIG. 21, the circuit elements may bearranged with a density lower than a density of the high-density region210 b at a portion of the first region ar1 excluding the non-arrangementregion AR6, a portion of the first region ar2 excluding thenon-arrangement region AR7, and a portion of the first region ar3excluding the non-arrangement region AR8. However, the circuit elementsare not arranged at these portions, and thus, it is possible to furtherimprove the position detection accuracy.

The same effects obtained by the configuration of the circuit board 21shown in FIGS. 19 to 21 are obtained even in the image shake correctiondevice 3 in which the movable member 2 can be moved only in the twodirections of the direction X and the direction Y. In a case where themovable member 2 is moved in three directions, the movable member 2becomes heavier. Thus, the configuration of the circuit board 21 shownin FIGS. 19 to 21 is particularly effective.

The region in which the circuit element including the magnetic materialsis not disposed may be a region in which the amount of magneticmaterials present in this region is a small amount to the extent thatthe influence on the magnetic field supplied to the Hall element can beignored. That is, it is most preferable that the region in which thecircuit element is not disposed is a region in which all the circuitelements including the magnetic materials are not present, but may be aregion in which a very small number of circuit elements including asmall amount of magnetic materials to the extent that the influence ofthe magnetic field on the Hall element can be ignored are present.

As long as the position can be detected by a change of the magneticfield supplied from the magnet, a magnetic sensor other than the Hallelement may be used as the position detector for detecting the positionof the movable member 2 in the image shake correction device 3.

Next, a configuration of a smartphone will be described as anotherembodiment of the imaging device of the present invention.

FIG. 22 shows an appearance of a smartphone 200 that is an embodiment ofthe imaging device of the present invention.

A smartphone 200 shown in FIG. 22 includes a flat plate casing 201, andcomprises a display input unit 204 in which a display panel 202 as adisplay surface and an operation panel 203 as an input unit areintegrated on one surface of the casing 201.

Such a casing 201 comprises a speaker 205, a microphone 206, anoperation unit 207, and a camera unit 208. The configuration of thecasing 201 is not limited thereto, and for example, a configuration inwhich the display surface and the input unit are independent can beemployed, or a configuration having a folding structure or a slidemechanism can be employed.

FIG. 23 is a block diagram showing a configuration of the smartphone 200shown in FIG. 22.

As shown in FIG. 23, the smartphone includes, as main components, awireless communication unit 210, the display input unit 204, a callhandling unit 211, the operation unit 207, the camera unit 208, astorage unit 212, an external input and output unit 213, a GlobalPositioning System (GPS) reception unit 214, a motion sensor unit 215, apower supply unit 216, and a main controller 220.

The smartphone 200 has, as a main function, a wireless communicationfunction of performing mobile wireless communication through a basestation apparatus BS (not shown) and a mobile communication network NW(not shown).

The wireless communication unit 210 performs wireless communication withthe base station apparatus BS belonging to the mobile communicationnetwork NW according to an instruction of the main controller 220. Thetransmission and reception of various file data such as voice data,image data, and e-mail data, and reception of Web data or streaming dataare performed by using this wireless communication.

Under the control of the main controller 220, the display input unit 204displays images (still images and moving images) or text information,and visually transmits the images and information to the user, and is aso-called touch panel that detects a user operation for the displayedinformation. The display input unit comprises the display panel 202 andthe operation panel 203.

The display panel 202 uses, as a display device, a liquid crystaldisplay (LCD) or an organic electro-luminescence display (OELD).

The operation panel 203 is a device that is mounted so as to visuallyrecognize the image displayed on the display surface of the displaypanel 202, and detects one or a plurality of coordinates operated by afinger of the user or a stylus. In a case where this device is operatedby the finger of the user or the stylus, a detection signal generateddue to the operation is output to the main controller 220. Subsequently,the main controller 220 detects an operation position (coordinates) onthe display panel 202 based on the received detection signal.

As shown in FIG. 23, although it has been described that the displaypanel 202 and the operation panel 203 of the smartphone 200 illustratedas the embodiment of the imaging device of the present invention areintegrally formed and constitute the display input unit 204, theoperation panel 203 is disposed so as to completely cover the displaypanel 202.

In a case where such an arrangement is adopted, the operation panel 203may have a function of detecting the user operation even in a regionoutside the display panel 202. In other words, the operation panel 203may have a detection region (hereinafter, referred to as a displayregion) for an overlapped portion which overlaps with the display panel202 and a detection region (hereinafter, referred to as a non-displayregion) for an outer edge portion which does not overlap with thedisplay panel 202.

The size of the display region and the size of the display panel 202 maycompletely match each other, and it is not necessary to match both thesizes. The operation panel 203 may have the outer edge portion and twosensitive regions which are inner portions other than the outer edge. Awidth of the outer edge portion is appropriately designed according tothe size of the casing 201.

Examples of the position detection method employed in the operationpanel 203 include a matrix switch method, a resistive film method, asurface acoustic wave method, an infrared method, an electromagneticinduction method, and an electrostatic capacitance method.

The call handling unit 211 comprises the speaker 205 or the microphone206, converts the voice of the user input through the microphone 206into voice data capable of being processed by the main controller 220 tooutput the voice data to the main controller 220 or decodes the voicedata received by the wireless communication unit 210 or the externalinput and output unit 213 to output the decoded voice data from thespeaker 205.

For example, as shown in FIG. 22, the speaker 205 may be mounted on thesame surface as the surface on which the display input unit 204 isprovided, and the microphone 206 may be mounted on a side surface of thecasing 201.

The operation unit 207 is a hardware key using a key switch, andreceives an instruction from the user. For example, as shown in FIG. 22,the operation unit 207 is a push button type switch which is mounted ona side surface of the casing 201 of the smartphone 200, and is turned onby being pressed with the finger and is turned off by a restoring forcesuch as a spring in a case where the finger is released.

The storage unit 212 stores a control program and control data of themain controller 220, application software, address data associated witha name or a telephone number of a communication partner, the transmittedand received e-mail data, Web data downloaded by Web browsing, anddownload content data, and temporarily stores streaming data. Thestorage unit 212 includes an internal storage unit 217 built in thesmartphone, and an external storage unit 218 having a slot for adetachable external memory.

The internal storage unit 217 and the external storage unit 218constituting the storage unit 212 is realized by using a storage mediumsuch as a memory (for example, MicroSD (registered trademark) memory) ofa flash memory type, a hard disk type, a multimedia card micro type, ora card type, a random access memory (RAM), or a read only memory (ROM).

The external input and output unit 213 serves as an interface with allexternal devices coupled to the smartphone 200, and directly orindirectly communicates with other external devices by (for example,universal serial bus (USB) or IEEE 1394) or a network (for example,Internet, wireless LAN, Bluetooth (registered trademark), radiofrequency identification (RFID), Infrared Data Association (IrDA)(registered trademark), ultra wideband (UWB) (registered trademark), orZigBee (registered trademark).

Examples of the external device to be connected to the smartphone 200includes a wired or wireless headset, an external wired or wirelesscharger, a wired or wireless data port, a memory card to be connectedthrough a card socket, subscriber identity module (SIM)/user identitymodule (UIM) card, or an external audio and video device to be connectedthrough an audio and video input and output (I/O) terminal, an externalaudio and video device to be connected in a wireless manner, asmartphone to be connected in a wired or wireless manner, a personalcomputer to be connected in a wired or wireless manner, or an earphoneto be connected in a wired or wireless manner.

The external input and output unit 213 can transfer data transmittedfrom the external devices to the components in the smartphone 200 or cantransmit data in the smartphone 200 to the external devices.

The GPS receiving unit 214 receives GPS signals transmitted from GPSsatellites ST1 to STn according to an instruction of the main controller220, performs positioning calculation processing based on a plurality ofreceived GPS signals, and detects the position of the smartphone 200having latitude, longitude, and altitude. In a case where positionalinformation can be acquired from the wireless communication unit 210 orthe external input and output unit 213 (for example, a wireless LAN),the GPS receiving unit 214 can detect the position by using thepositional information.

For example, the motion sensor unit 215 comprises a three-axisacceleration sensor, and detects physical motion of the smartphone 200according to an instruction of the main controller 220. The movementdirection or acceleration of the smartphone 200 is detected by detectingthe physical motion of the smartphone 200. The detection result isoutput to the main controller 220.

The power supply unit 216 supplies power stored in a battery (not shown)to the respective units of the smartphone 200 according to aninstruction of the main controller 220.

The main controller 220 comprises a microprocessor, operates accordingto the control program or control data stored in the storage unit 212,and integrally controls the units of the smartphone 200. The maincontroller 220 has a mobile communication control function ofcontrolling the units of a communication system in order to performvoice communication or data communication through the wirelesscommunication unit 210, and an application processing function.

The application processing function is realized by the main controller220 operating according to application software stored in the storageunit 212. The application processing function is, for example, aninfrared communication function of controlling the external input andoutput unit 213 to perform data communication with a device facing thesmartphone, an electronic mail function of transmitting and receivingelectronic mails, or a Web browsing function of browsing Web pages.

The main controller 220 has an image processing function of displayingvideo on the display input unit 204 based on image data (still image ormoving image data), such as received data or downloaded streaming data.

The image processing function refers to a function of the maincontroller 220 decoding the image data, performing image processing onthe decoding result, and displaying an image on the display input unit204.

The main controller 220 performs display control on the display panel202 and operation detection control for detecting a user operationthrough the operation unit 207 and the operation panel 203.

Through the performing of the display control, the main controller 220displays an icon for activating application software or a software key,such as a scroll bar, or displays a window for creating electronicmails.

The scroll bar refers to a software key for receiving an instruction tomove a display portion of an image which is too large to fit into thedisplay region of the display panel 202.

Through the performing of the operation detection control, the maincontroller 220 detects the user operation through the operation unit207, receives an operation on the icon or an input of a character stringin an input field of the window through the operation panel 203, orreceives a scroll request of a display image through the scroll bar.

Through the performing of the operation detection control, the maincontroller 220 has a touch panel control function of determining whetheror not an operation position on the operation panel 203 is thesuperimposed portion (display region) overlapping the display panel 202or the outer edge portion (non-display region) not overlapping thedisplay panel 202 other than the display region, and controlling thesensitive region of the operation panel 203 or the display position ofthe software key.

The main controller 220 may detect a gesture operation on the operationpanel 203 and may execute a function set in advance according to thedetected gesture operation.

The gesture operation is not a conventional simple touch operation, butmeans an operation to render a track with a finger, an operation tosimultaneously designate a plurality of positions, or an operation torender a track for at least one of a plurality of positions by combiningthe aforementioned operations.

The camera unit 208 includes components other than the motion detectionsensor 106, the system controller 108, and the image processing unit 107of the digital camera 100 shown in FIG. 1. In the smartphone 200, themain controller 220 controls the image shake correction device 3 basedon information from the motion sensor unit 215 corresponding to themotion detection sensor 106 to perform image shake correction.

Captured image data generated by the camera unit 208 can be recorded inthe storage unit 212 or can be output through the external input andoutput unit 213 or the wireless communication unit 210.

Although it has been described in the smartphone 200 shown in FIG. 22that the camera unit 208 is mounted on the same surface as the displayinput unit 204, the mounting position of the camera unit 208 is notlimited thereto, and the camera unit may be mounted on the rear surfaceof the display input unit 204.

The camera unit 208 can be used for various functions of the smartphone200. For example, an image acquired by the camera unit 208 can bedisplayed on the display panel 202, or an image in the camera unit 208can be used as one operation input of the operation panel 203.

In a case where the GPS receiving unit 214 detects the position, theposition may be detected by referring to an image from the camera unit208. The optical axis direction of the camera unit 208 of the smartphone200 can be determined or a current usage environment may be determinedby referring to an image from the camera unit 208 without using thethree-axis acceleration sensor or in combination with the three-axisacceleration sensor. An image from the camera unit 208 may be used inapplication software.

Image data of a still image or a moving image may be attached withpositional information acquired by the GPS receiving unit 214, voiceinformation (which may be converted to text information throughvoice-text conversion by the main controller) acquired by the microphone206, or posture information acquired by the motion sensor unit 215 andcan be recorded in the storage unit 212, or may be output through theexternal input and output unit 213 or the wireless communication unit210.

In the smartphone 200 having the aforementioned configuration, the imageshake correction device 3 has the aforementioned configuration, andthus, it is possible to obtain various effects.

As described above, the following items are disclosed in thisspecification.

(1) There is provided an image shake correction device comprising amovable member that is supported to be movable in a plurality ofdirections along a flat surface, a circuit board that is fixed to themovable member, an imager that is mounted on the circuit board, and aplurality of position detectors that is fixed to a rear surface of thecircuit board opposite to a surface of the circuit board on which theimager is mounted to detect a position of the movable member in amovement direction of the movable member by a change of a magnetic fieldsupplied from the rear surface side of the circuit board. A plurality ofcircuit elements including magnetic materials is formed on the rearsurface of the circuit board, and a high-density region in which thecircuit elements are disposed is formed in a second region around afirst region on the rear surface of the circuit board which overlaps amagnet that supplies the magnetic field with a density higher than adensity of the circuit elements in a region excluding the second regionon the rear surface of the circuit board, as viewed in a directionperpendicular to the flat surface.

(2) The image shake correction device according to (1) further comprisesa support member that supports the movable member to be movable in theplurality of directions, and the magnet that faces each of the pluralityof position detectors, and is fixed to the support member.

(3) In the image shake correction device according to (1) or (2), theplurality of directions includes a longitudinal direction of a lightreceiving surface of the imager and a short direction of the lightreceiving surface of the imager, and the high-density region is formedso as to be adjacent to at least an end portion of the first region onone side of the short direction.

(4) In the image shake correction device according to (3), thehigh-density region is further formed so as to be adjacent to both endportions of the first region in the longitudinal direction.

(5) In the image shake correction device according to any one of (1) to(4), a region in which the circuit element is not disposed is formedaround the position detector in the first region.

(6) In the image shake correction device according to (5), the pluralityof directions includes a longitudinal direction of a light receivingsurface of the imager and a short direction of the light receivingsurface of the imager, and at least the region in which the circuitelement is not disposed is formed in a square-shaped range having twosides parallel to the longitudinal direction and two sides parallel tothe short direction using the position detector as a center in the firstregion.

(7) There is provided an imaging device comprising the image shakecorrection device according to any one of (1) to (6).

The present invention is highly convenient and effective by beingapplied to a digital camera such as a single-lens reflex camera or amirrorless camera, an in-vehicle camera, a surveillance camera, or asmartphone.

Although the present invention has been described in conjunction withthe specific embodiments, the present invention is not limited to theseembodiments, and can be variously changed without departing from thetechnical idea of the disclosed invention. This application is based onJapanese Patent Application (JP2017-186874) filed Sep. 27, 2017, thecontent of which is incorporated herein.

EXPLANATION OF REFERENCES

-   -   100: digital camera    -   101: imaging optical system    -   20: imager    -   3: image shake correction device    -   104: AFE    -   105: imager drive unit    -   106: motion detection sensor    -   108: system controller    -   107: image processing unit    -   K: optical axis    -   1: support member    -   1A: first support member    -   Mh1: X-axis position detection magnet    -   Mh2: Y-axis rotation position detection magnet    -   Mh3: Y-axis rotation position detection magnet    -   1 s, 2 s, 3 s: S-pole    -   1 n, 2 n, 3 n: N-pole    -   Mv1: X-axis rotation drive magnet    -   Mv2: X-axis rotation drive magnet    -   Mv3: Y-axis drive magnet    -   1B: second support member    -   mv1: X-axis rotation drive magnet    -   mv2: X-axis rotation drive magnet    -   mv3: Y-axis drive magnet    -   2: movable member    -   C1: X-axis rotation drive coil    -   C2: X-axis rotation drive coil    -   C3: Y-axis drive coil    -   21: circuit board    -   H1: X-axis position detection Hall element    -   H2: Y-axis rotation position detection Hall element    -   H3: Y-axis rotation position detection Hall element    -   20 a: light receiving surface    -   P: center of light receiving surface    -   R: rotation axis    -   10: base    -   11 a, 11 b: through-hole    -   12, 14: yoke    -   13: coupling member    -   15 a, 15 b, 15 c: flat surface    -   16 a, 16 b, 16 c: hook    -   17 a, 17 b, 17 c: projecting portion    -   18: yoke    -   19 a: hole portion    -   19 b, 19 c: notch portion    -   SC1, SC2, SC3, SC4: screw    -   21 a, 21 b, 21 c: connector    -   22: base    -   23 a, 23 b, 23 c: hook    -   24 a, 24 b, 24 c: spring    -   25, 26, 27: flexible print substrate    -   25 a, 26 a: first portion    -   270: second portion    -   25 b, 26 b, 271: folded portion    -   27 a: fixed portion    -   27 b: non-fixed portion    -   28A, 28A: attachment portion    -   28 a, 28 b: insertion member    -   280 a, 280 b: flat plate portion    -   29 a, 29 b, 29 c: bottom surface    -   290 a, 290 b, 290 c: recess portion    -   MR1, MR2 Movement Restriction Department    -   L1, L2, L3: straight line    -   L4: extension line    -   110, 111, 113, 114: side    -   115, 116, 117, 118: curve    -   110 p: center of through-hole    -   L5: first extension line    -   L6: second extension line    -   L7: third extension line    -   L8: fourth extension line    -   160 a, 160 b, 160 c, 160 d: hook    -   230 a, 230 b, 230 c: hook    -   TR: equilateral triangle    -   ar1, ar2, ar3: first region    -   AR1, AR2, AR3: second region    -   21 b: high-density region    -   AR6, AR7, AR8: non-arrangement region    -   200: smartphone    -   201: casing    -   202: display panel    -   203: operation panel    -   204: display input unit    -   205: speaker    -   206: microphone    -   207: operation unit    -   208: camera unit    -   210: wireless communication unit    -   211: call handling unit    -   212: storage unit    -   213: external input and output unit    -   214: GPS receiving unit    -   215: motion sensor unit    -   216: power supply unit    -   217: internal storage unit    -   218: external storage unit    -   220: main controller    -   ST1 to STn: GPS satellites

What is claimed is:
 1. An image shake correction device comprising: amovable member that is supported to be movable in a plurality ofdirections along a flat surface; a circuit board that is fixed to themovable member; an imager that is mounted on the circuit board; and aplurality of position detectors that is fixed to a rear surface of thecircuit board opposite to a surface of the circuit board on which theimager is mounted to detect a position of the movable member in amovement direction of the movable member by a change of a magnetic fieldsupplied from the rear surface side of the circuit board, wherein aplurality of circuit elements including magnetic materials is formed onthe rear surface of the circuit board, and a high-density region inwhich the circuit elements are disposed at a higher density is formed ina second region around a first region on the rear surface of the circuitboard which overlaps a magnet that supplies the magnetic field as viewedin a direction perpendicular to the flat surface, the higher densitybeing higher than a density of the circuit elements in a regionexcluding the second region on the rear surface of the circuit board. 2.The image shake correction device according to claim 1, furthercomprising: a support member that supports the movable member to bemovable in the plurality of directions; and the magnet that faces eachof the plurality of the position detectors, and is fixed to the supportmember.
 3. The image shake correction device according to claim 2,wherein the plurality of directions includes a longitudinal direction ofa light receiving surface of the imager and a short direction of thelight receiving surface of the imager, and the high-density region isformed so as to be adjacent to at least an end portion of the firstregion on one side of the short direction.
 4. The image shake correctiondevice according to claim 3, wherein the high-density region is furtherformed so as to be adjacent to both end portions of the first region inthe longitudinal direction.
 5. The image shake correction deviceaccording to claim 4, wherein a region in which the circuit element isnot disposed is formed around the position detector in the first region.6. The image shake correction device according to claim 5, wherein theplurality of directions includes a longitudinal direction of a lightreceiving surface of the imager and a short direction of the lightreceiving surface of the imager, and at least the region in which thecircuit element is not disposed is formed in a square-shaped rangehaving two sides parallel to the longitudinal direction and two sidesparallel to the short direction, wherein a center of the square-shapedrange is the position detector in the first region.
 7. The image shakecorrection device according to claim 3, wherein a region in which thecircuit element is not disposed is formed around the position detectorin the first region.
 8. The image shake correction device according toclaim 7, wherein the plurality of directions includes a longitudinaldirection of a light receiving surface of the imager and a shortdirection of the light receiving surface of the imager, and at least theregion in which the circuit element is not disposed is formed in asquare-shaped range having two sides parallel to the longitudinaldirection and two sides parallel to the short direction, wherein acenter of the square-shaped range is the position detector in the firstregion.
 9. The image shake correction device according to claim 2,wherein a region in which the circuit element is not disposed is formedaround the position detector in the first region.
 10. The image shakecorrection device according to claim 9, wherein the plurality ofdirections includes a longitudinal direction of a light receivingsurface of the imager and a short direction of the light receivingsurface of the imager, and at least the region in which the circuitelement is not disposed is formed in a square-shaped range having twosides parallel to the longitudinal direction and two sides parallel tothe short direction, wherein a center of the square-shaped range is theposition detector in the first region.
 11. The image shake correctiondevice according to claim 1, wherein the plurality of directionsincludes a longitudinal direction of a light receiving surface of theimager and a short direction of the light receiving surface of theimager, and the high-density region is formed so as to be adjacent to atleast an end portion of the first region on one side of the shortdirection.
 12. The image shake correction device according to claim 11,wherein the high-density region is further formed so as to be adjacentto both end portions of the first region in the longitudinal direction.13. The image shake correction device according to claim 12, wherein aregion in which the circuit element is not disposed is formed around theposition detector in the first region.
 14. The image shake correctiondevice according to claim 13, wherein the plurality of directionsincludes a longitudinal direction of a light receiving surface of theimager and a short direction of the light receiving surface of theimager, and at least the region in which the circuit element is notdisposed is formed in a square-shaped range having two sides parallel tothe longitudinal direction and two sides parallel to the shortdirection, wherein a center of the square-shaped range is the positiondetector in the first region.
 15. The image shake correction deviceaccording to claim 11, wherein a region in which the circuit element isnot disposed is formed around the position detector in the first region.16. The image shake correction device according to claim 15, wherein theplurality of directions includes a longitudinal direction of a lightreceiving surface of the imager and a short direction of the lightreceiving surface of the imager, and at least the region in which thecircuit element is not disposed is formed in a square-shaped rangehaving two sides parallel to the longitudinal direction and two sidesparallel to the short direction, wherein a center of the square-shapedrange is the position detector in the first region.
 17. The image shakecorrection device according to claim 1, wherein a region in which thecircuit element is not disposed is formed around the position detectorin the first region.
 18. The image shake correction device according toclaim 17, wherein the plurality of directions includes a longitudinaldirection of a light receiving surface of the imager and a shortdirection of the light receiving surface of the imager, and at least theregion in which the circuit element is not disposed is formed in asquare-shaped range having two sides parallel to the longitudinaldirection and two sides parallel to the short direction, wherein acenter of the square-shaped range is the position detector in the firstregion.
 19. An imaging device comprising the image shake correctiondevice according to claim 1.